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Microcontrollers and Processors / Microprocessors / MPC8306CVMADDCA
Datasheets
MPC8306CVMADDCA by:
Freescale Semiconductor

32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369

Part Details for MPC8306CVMADDCA by Freescale Semiconductor

Results Overview of MPC8306CVMADDCA by Freescale Semiconductor

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Applications Industrial Automation Renewable Energy Robotics and Drones

MPC8306CVMADDCA Information

MPC8306CVMADDCA by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MPC8306CVMADDCA

Part # Distributor Description Stock Price Buy
Win Source Electronics IC MPU MPC83XX 266MHZ 369BGA / PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 369-PBGA (19x19) 518
  • 1 $471.9000
$471.9000 Buy Now

Part Details for MPC8306CVMADDCA

MPC8306CVMADDCA CAD Models

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MPC8306CVMADDCA Part Data Attributes

Parametric Data
MPC8306CVMADDCA Freescale Semiconductor
Buy Now Datasheet
Compare Parts:
MPC8306CVMADDCA Freescale Semiconductor 32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Pin Count 369
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66.67 MHz
External Data Bus Width
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B369
JESD-609 Code e2
Length 19 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 369
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.61 mm
Speed 266 MHz
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC8306CVMADDCA

This table gives cross-reference parts and alternative options found for MPC8306CVMADDCA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC8306CVMADDCA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MPC8306VMADFCA NXP Semiconductors Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369 MPC8306CVMADDCA vs MPC8306VMADFCA
MPC8306CVMADDCA NXP Semiconductors Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369 MPC8306CVMADDCA vs MPC8306CVMADDCA
MPC8306SCVMADDCA NXP Semiconductors Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369 MPC8306CVMADDCA vs MPC8306SCVMADDCA
MPC8306VMADFCA Freescale Semiconductor Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306VMADFCA
MPC8306VMADDCA NXP Semiconductors Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369 MPC8306CVMADDCA vs MPC8306VMADDCA
Part Number Manufacturer Composite Price Description Compare
MPC8306SVMADDCA Freescale Semiconductor Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 MPC8306CVMADDCA vs MPC8306SVMADDCA
MPC8306VMADDCA Freescale Semiconductor Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306VMADDCA
MPC8306CVMADFCA Freescale Semiconductor Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306CVMADFCA
MPC8306SCVMABCA Freescale Semiconductor Check for Price 32-BIT, 133MHz, RISC PROCESSOR, PBGA369, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 MPC8306CVMADDCA vs MPC8306SCVMABCA
MPC8306SCVMACCA Freescale Semiconductor Check for Price 32-BIT, 200MHz, RISC PROCESSOR, PBGA369, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 MPC8306CVMADDCA vs MPC8306SCVMACCA
MPC8306VMABFCA Freescale Semiconductor Check for Price 32-BIT, 133MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306VMABFCA
MPC8306VMACFCA Freescale Semiconductor Check for Price 32-BIT, 200MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306VMACFCA
MPC8306CVMACFCA Freescale Semiconductor Check for Price 32-BIT, 200MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306CVMACFCA
MPC8306CVMAFDCA Freescale Semiconductor Check for Price PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1 MPC8306CVMADDCA vs MPC8306CVMAFDCA
MPC8306VMAFFCA Freescale Semiconductor Check for Price 32-BIT, 333MHz, RISC PROCESSOR, PBGA369, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 MPC8306CVMADDCA vs MPC8306VMAFFCA

MPC8306CVMADDCA Related Parts

MPC8306CVMADDCA Frequently Asked Questions (FAQ)

  • The recommended power-on sequence is to apply power to the VDD_CORE and VDD_MCU pins simultaneously, followed by the VDD_DDR and VDD_IO pins. This ensures proper initialization of the device.

  • The DDR memory interface can be configured using the DDR Controller registers. The configuration involves setting the memory timing parameters, such as clock frequency, CAS latency, and burst length, as well as enabling/disabling the DDR clock and data bus.

  • The maximum operating frequency of the e300 core on the MPC8306CVMADDCA is 400 MHz. However, the actual operating frequency may be limited by the system design, power consumption, and thermal considerations.

  • The Secure Boot mechanism on the MPC8306CVMADDCA involves using a secure boot loader that authenticates the firmware image before booting. This requires generating a secure boot key, creating a secure boot image, and configuring the device to use the secure boot mechanism.

  • The MPC8306CVMADDCA has a maximum junction temperature of 105°C. To ensure reliable operation, the device should be operated within the recommended temperature range, and thermal management techniques such as heat sinks, thermal interfaces, and airflow management should be used to keep the device temperature within safe limits.

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