Part Details for MPC7410VS500LE by Rochester Electronics LLC
Results Overview of MPC7410VS500LE by Rochester Electronics LLC
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MPC7410VS500LE Information
MPC7410VS500LE by Rochester Electronics LLC is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MPC7410VS500LE
MPC7410VS500LE CAD Models
MPC7410VS500LE Part Data Attributes
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MPC7410VS500LE
Rochester Electronics LLC
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MPC7410VS500LE
Rochester Electronics LLC
32-BIT, 500 MHz, RISC PROCESSOR, CLGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360
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| Pbfree Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
| Part Package Code | LGA | |
| Package Description | HBGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-BU360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 2.2 mm | |
| Speed | 500 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | NOT SPECIFIED | |
| Terminal Form | BUTT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |