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Microcontrollers and Processors / Microprocessors / MPC7410HX450LE
Datasheets
MPC7410HX450LE by:

NT HITCE RV1.4,1.8V,105C

Part Details for MPC7410HX450LE by Freescale Semiconductor

Results Overview of MPC7410HX450LE by Freescale Semiconductor

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MPC7410HX450LE Information

MPC7410HX450LE by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MPC7410HX450LE

Part # Distributor Description Stock Price Buy
Bristol Electronics   4
RFQ
Quest Components 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 3
  • 1 $187.5000
  • 2 $178.1250
  • 4 $168.7500
$168.7500 / $187.5000 Buy Now

Part Details for MPC7410HX450LE

MPC7410HX450LE CAD Models

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MPC7410HX450LE Part Data Attributes

Parametric Data
MPC7410HX450LE Freescale Semiconductor
Buy Now Datasheet
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MPC7410HX450LE Freescale Semiconductor NT HITCE RV1.4,1.8V,105C
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Pin Count 360
Reach Compliance Code not_compliant
ECCN Code 3A991.A.1
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HBGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 450 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC7410HX450LE

This table gives cross-reference parts and alternative options found for MPC7410HX450LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410HX450LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MPC7410RX450LD Motorola Mobility LLC Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450LD
PC7410VGU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VGU450LE
PCX7410VGHU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGHU450LE
PCX7410VGU450LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGU450LE
MPC7410RX450LE Motorola Mobility LLC Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450LE
PCX7410VGHU450LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGHU450LE
Part Number Manufacturer Composite Price Description Compare
PC7410VG450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VG450LE
MPC7410HX450LE Motorola Mobility LLC Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410HX450LE
MPC7410TRX450NE Freescale Semiconductor Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410TRX450NE
PCX7410VGSU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGSU450LE
PC7410VGSU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VGSU450LE
PC7410VGH450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VGH450LE
PCX7410MGHU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410MGHU450LE
MPC7410RX450LC Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450LC
PC7410MGS450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410MGS450LE
MPC7410RX450NE Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450NE

MPC7410HX450LE Related Parts

MPC7410HX450LE Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the MPC7410HX450LE is -40°C to 105°C, with a junction temperature of up to 125°C.

  • The clocking system on the MPC7410HX450LE can be configured using the Clock Generation Module (CGM) and the Phase-Locked Loop (PLL) modules. The CGM generates the clock signals for the processor core, bus, and peripherals, while the PLL generates the high-frequency clock signals. The configuration is done through register programming and can be found in the device's reference manual.

  • The maximum frequency of the e600 core on the MPC7410HX450LE is 450 MHz.

  • The power consumption of the MPC7410HX450LE depends on the operating frequency, voltage, and usage. However, according to the datasheet, the typical power consumption is around 2.5W at 450 MHz and 1.2V.

  • Yes, the MPC7410HX450LE supports DDR2 memory up to 400 MHz.

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