Part Details for MPC5554MZP132R2 by Freescale Semiconductor
Results Overview of MPC5554MZP132R2 by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MPC5554MZP132R2 Information
MPC5554MZP132R2 by Freescale Semiconductor is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MPC5554MZP132R2
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 922 |
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RFQ |
Part Details for MPC5554MZP132R2
MPC5554MZP132R2 CAD Models
MPC5554MZP132R2 Part Data Attributes
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MPC5554MZP132R2
Freescale Semiconductor
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MPC5554MZP132R2
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 2MB Flash, 132MHz, -40/+125degC, Automotive Grade, PBGA 416
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | |
Pin Count | 416 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Additional Feature | IT ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 2097152 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 132 MHz | |
Supply Current-Max | 600 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN LEAD SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |