Part Details for MMPF0200F0AEPR2 by NXP Semiconductors
Results Overview of MMPF0200F0AEPR2 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
MMPF0200F0AEPR2 Information
MMPF0200F0AEPR2 by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MMPF0200F0AEPR2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
08X2814
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Newark | Power Management Ic, I.mx6, Pre-Prog, 12 Ch, 3/4 Buck, 6 Ldo, 1 Boost, Qfn 56/ Reel Rohs Compliant: Yes |Nxp MMPF0200F0AEPR2 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.0200 | Buy Now |
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DISTI #
MMPF0200F0AEPR2-ND
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DigiKey | IC REG CONV I.MX6 11OUT 56HVQFN Min Qty: 4000 Lead time: 16 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$4.4835 | Buy Now |
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DISTI #
MMPF0200F0AEPR2
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Avnet Americas | 12 Channel Configurable Power Management IC 56-Pin QFN EP T/R - Tape and Reel (Alt: MMPF0200F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$3.9851 / $4.1203 | Buy Now |
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DISTI #
MMPF0200F0AEPR2
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Avnet Americas | 12 Channel Configurable Power Management IC 56-Pin QFN EP T/R - Tape and Reel (Alt: MMPF0200F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$3.8165 / $4.0866 | Buy Now |
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DISTI #
841-MMPF0200F0AEPR2
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX6, pre-prog, 12 ch, 3/4 buck, 6 LDO, 1 boost, QFN 56 RoHS: Compliant | 0 |
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$4.3900 | Order Now |
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DISTI #
MMPF0200F0AEPR2
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Avnet Silica | 12 Channel Configurable Power Management IC 56Pin QFN EP TR (Alt: MMPF0200F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MMPF0200F0AEPR2
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EBV Elektronik | 12 Channel Configurable Power Management IC 56Pin QFN EP TR (Alt: MMPF0200F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC PW MGMT I.MX6 56QFN | 3810 |
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$8.4592 / $12.6888 | Buy Now |
Part Details for MMPF0200F0AEPR2
MMPF0200F0AEPR2 CAD Models
MMPF0200F0AEPR2 Part Data Attributes
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MMPF0200F0AEPR2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MMPF0200F0AEPR2
NXP Semiconductors
POWER SUPPLY SUPPORT CKT
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | NXP | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N56 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 12 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |
MMPF0200F0AEPR2 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
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Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
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Ensure a controlled power-on sequence, with the core voltage (VDD) ramping up before the input/output voltage (VDDIO). Use a soft-start circuit to limit inrush current and prevent voltage overshoot.
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Use the power-saving features, such as dynamic voltage and frequency scaling, and clock gating. Implement a low-power mode or sleep mode when the device is idle. Optimize the system's power management IC (PMIC) for efficient power conversion.
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Handle the device by the body or use an anti-static wrist strap. Ensure the PCB is designed with ESD protection diodes and resistors. Use an ESD-protected workstation and follow proper packaging and storage procedures.