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Part Details for MMPF0200F0AEP by NXP Semiconductors
Results Overview of MMPF0200F0AEP by NXP Semiconductors
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
MMPF0200F0AEP Information
MMPF0200F0AEP by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MMPF0200F0AEP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2890446
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Farnell | POWER MANAGEMENT IC, HVQFN-56 RoHS: Compliant Min Qty: 1 Lead time: 16 Weeks, 0 Days Container: Each | 280 |
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$4.2023 / $4.2688 | Buy Now |
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DISTI #
MMPF0200F0AEP-ND
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DigiKey | IC REG CONV I.MX6 11OUT 56HVQFN Min Qty: 1 Lead time: 16 Weeks Container: Tray |
1288 In Stock |
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$4.5051 / $7.0800 | Buy Now |
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DISTI #
MMPF0200F0AEP
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Avnet Americas | 12 Channel Configurable Power Management IC 56-Pin QFN EP Tray - Trays (Alt: MMPF0200F0AEP) RoHS: Compliant Min Qty: 780 Package Multiple: 260 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3.8502 / $4.5257 | Buy Now |
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DISTI #
841-MMPF0200F0AEP
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX6, pre-prog, 12 ch, 3/4 buck, 6 LDO, 1 boost, QFN 56 RoHS: Compliant | 323 |
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$4.3800 / $4.6900 | Buy Now |
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DISTI #
V99:2348_07194723
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Arrow Electronics | Power Management IC 2.8V to 4.5V Medical 56-Pin QFN EP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2323 | Americas - 1820 |
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$2.5830 / $4.3441 | Buy Now |
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DISTI #
70332572
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Verical | Power Management IC 2.8V to 4.5V Medical 56-Pin QFN EP Tray RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 2323 | Americas - 1820 |
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$5.0430 | Buy Now |
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DISTI #
MMPF0200F0AEP
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Avnet Silica | 12 Channel Configurable Power Management IC 56Pin QFN EP Tray (Alt: MMPF0200F0AEP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | Silica - 260 |
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Buy Now | |
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DISTI #
MMPF0200F0AEP
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EBV Elektronik | 12 Channel Configurable Power Management IC 56Pin QFN EP Tray (Alt: MMPF0200F0AEP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC REG CONV I.MX6 11OUT 56HVQFN / series Converter, i.MX6 Voltage Regulator IC 11 Output 56-HVQFN (8x8) | 4000 |
|
$8.4592 / $12.6888 | Buy Now |
Part Details for MMPF0200F0AEP
MMPF0200F0AEP CAD Models
MMPF0200F0AEP Part Data Attributes
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MMPF0200F0AEP
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MMPF0200F0AEP
NXP Semiconductors
POWER SUPPLY SUPPORT CKT
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | NXP | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N56 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 12 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |
MMPF0200F0AEP Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal simulation tools to optimize the design.
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The critical timing parameters include the input rise and fall times, output delay, and clock frequency. Refer to the datasheet for specific values and ensure that your design meets these requirements.
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Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.
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Use 10nF to 100nF decoupling capacitors placed as close as possible to the device's power pins. The capacitor values and placement may vary depending on the specific application and PCB design.