Part Details for MMPF0100F0AEPR2 by NXP Semiconductors
Results Overview of MMPF0100F0AEPR2 by NXP Semiconductors
- Distributor Offerings: (15 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
MMPF0100F0AEPR2 Information
MMPF0100F0AEPR2 by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MMPF0100F0AEPR2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
64AH4195
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Newark | Power Management Ic, -40 To 85Deg C Rohs Compliant: Yes |Nxp MMPF0100F0AEPR2 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 3449 |
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$5.3000 / $8.7200 | Buy Now |
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DISTI #
38AH8822
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Newark | Power Management Ic, I.mx6, Pre-Prog, 10 Bit Adc ,4/6 Buck, 6 Ldo, 5 Boost, Qfn 56 Rohs Compliant: Yes |Nxp MMPF0100F0AEPR2 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.4300 | Buy Now |
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DISTI #
08X2807
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Newark | Power Management Ic, I.mx6, Pre-Prog, 10 Bit Adc ,4/6 Buck, 7 Ldo, 5 Boost, Qfn 56/ Reel Rohs Compliant: Yes |Nxp MMPF0100F0AEPR2 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.4300 | Buy Now |
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DISTI #
568-15242-1-ND
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DigiKey | IC REG CONV I.MX6 12OUT 56HVQFN Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
6490 In Stock |
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$5.2556 / $9.0900 | Buy Now |
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DISTI #
MMPF0100F0AEPR2
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Avnet Americas | Power Management Integrated Circuit 56-Pin QFN EP T/R - Tape and Reel (Alt: MMPF0100F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 4000 |
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$4.2414 / $4.9855 | Buy Now |
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DISTI #
841-MMPF0100F0AEPR2
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Mouser Electronics | Power Management Specialized - PMIC PFUZE100 RoHS: Compliant | 263 |
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$5.1800 / $8.3700 | Buy Now |
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DISTI #
V72:2272_07194685
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Arrow Electronics | PMIC Solution 2.8V to 4.5V 56-Pin HVQFN EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2307 Container: Cut Strips | Americas - 2041 |
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$4.9940 / $7.3050 | Buy Now |
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DISTI #
79931706
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Verical | PMIC Solution 2.8V to 4.5V 56-Pin HVQFN EP T/R RoHS: Compliant Min Qty: 6 Package Multiple: 1 Date Code: 2341 | Americas - 3775 |
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$4.8900 / $8.3300 | Buy Now |
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DISTI #
67203137
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Verical | PMIC Solution 2.8V to 4.5V 56-Pin HVQFN EP T/R RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 2307 | Americas - 2041 |
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$4.9940 / $7.3050 | Buy Now |
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DISTI #
MMPF0100F0AEPR2
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Avnet Silica | Power Management Integrated Circuit 56Pin QFN EP TR (Alt: MMPF0100F0AEPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for MMPF0100F0AEPR2
MMPF0100F0AEPR2 CAD Models
MMPF0100F0AEPR2 Part Data Attributes
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MMPF0100F0AEPR2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MMPF0100F0AEPR2
NXP Semiconductors
14-CHANNEL POWER SUPPLY SUPPORT CKT, QCC56
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | QFN-56 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | NXP | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N56 | |
| JESD-609 Code | e3 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 14 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |
Alternate Parts for MMPF0100F0AEPR2
This table gives cross-reference parts and alternative options found for MMPF0100F0AEPR2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MMPF0100F0AEPR2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MMPF0100F0EPR2 | Freescale Semiconductor | Check for Price | Power Management IC, i.MX6, pre-prog ,4/6 buck, 6 LDO, 1 boost, QFN 56, Reel | MMPF0100F0AEPR2 vs MMPF0100F0EPR2 |
| MMPF0100F0EP | Freescale Semiconductor | Check for Price | Power Management IC, i.MX6, pre-prog ,4/6 buck, 6 LDO, 1 boost, QFN 56, Tray | MMPF0100F0AEPR2 vs MMPF0100F0EP |
MMPF0100F0AEPR2 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
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Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer.
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Use a shielded enclosure, ensure proper grounding, and follow best practices for PCB layout and routing. Implement EMI filters and shielding on critical signals, and consider using a common-mode choke.
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Implement power gating, use dynamic voltage and frequency scaling, and optimize the system's clock frequency. Also, consider using low-power modes and shutdown modes when possible.
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Perform functional testing, including voltage and current measurements, and validate the device's performance across the entire operating temperature range. Use a thermal chamber and a network analyzer for comprehensive testing.