Part Details for MMBD914LT1XT by Infineon Technologies AG
Results Overview of MMBD914LT1XT by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
Telecommunications
Renewable Energy
MMBD914LT1XT Information
MMBD914LT1XT by Infineon Technologies AG is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for MMBD914LT1XT
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Diodes | 55 |
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RFQ |
Part Details for MMBD914LT1XT
MMBD914LT1XT CAD Models
MMBD914LT1XT Part Data Attributes
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MMBD914LT1XT
Infineon Technologies AG
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Datasheet
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MMBD914LT1XT
Infineon Technologies AG
Rectifier Diode, 1 Element, 0.25A, Silicon, ROHS COMPLIANT PACKAGE-3
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | ROHS COMPLIANT PACKAGE-3 | |
| Pin Count | 3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.70 | |
| Factory Lead Time | 39 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Application | GENERAL PURPOSE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Output Current-Max | 0.25 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Power Dissipation-Max | 0.37 W | |
| Reference Standard | AEC-Q101 | |
| Reverse Recovery Time-Max | 0.004 µs | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL |
MMBD914LT1XT Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component away from other heat sources and using a heat sink can also improve thermal performance.
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To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings specified in the datasheet. Additionally, use a stable voltage source and decoupling capacitors to minimize noise and ensure a stable bias voltage.
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To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD strap, and use ESD-safe packaging and tools. Avoid touching the device's pins or leads, and use a wrist strap or mat to discharge static electricity.
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The optimal gate resistor value depends on the specific application and the required switching frequency. A good starting point is to use the recommended value in the datasheet, and then adjust based on the specific requirements of your application.
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When paralleling multiple devices, ensure that each device has its own gate resistor and that the gate signals are properly synchronized. Additionally, consider the thermal performance and ensure that the devices are properly heat-sunk to prevent thermal runaway.