Part Details for MLX80051KLW-CAA-000-RE by Melexis Microelectronic Integrated Systems
Results Overview of MLX80051KLW-CAA-000-RE by Melexis Microelectronic Integrated Systems
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Applications
Industrial Automation
Renewable Energy
Automotive
Robotics and Drones
MLX80051KLW-CAA-000-RE Information
MLX80051KLW-CAA-000-RE by Melexis Microelectronic Integrated Systems is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for MLX80051KLW-CAA-000-RE
MLX80051KLW-CAA-000-RE CAD Models
MLX80051KLW-CAA-000-RE Part Data Attributes
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MLX80051KLW-CAA-000-RE
Melexis Microelectronic Integrated Systems
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Datasheet
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MLX80051KLW-CAA-000-RE
Melexis Microelectronic Integrated Systems
Support Circuit, 5 X 5 MM, 0.65 MM PITCH, QFN-20
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MELEXIS N V | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Melexis | |
| JESD-30 Code | S-XQCC-N20 | |
| JESD-609 Code | e3 | |
| Length | 5 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 12 V | |
| Surface Mount | YES | |
| Telecom IC Type | LIN TRANSCEIVER | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 5 mm |
MLX80051KLW-CAA-000-RE Frequently Asked Questions (FAQ)
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The recommended operating temperature range is -20°C to 85°C, with a storage temperature range of -40°C to 125°C.
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The device is designed to withstand thermal shock and vibration according to the IEC 60068-2-27 and IEC 60068-2-6 standards, respectively.
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The typical response time is around 10 ms, but this can vary depending on the specific application and environmental conditions.
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Yes, the device is designed to operate in humid environments, but it's essential to follow proper sealing and packaging guidelines to prevent moisture ingress.
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The device is designed to be EMI-resistant, but it's still important to follow proper PCB design and layout guidelines to minimize EMI effects.