Datasheets
MLF2012DR82K by:

General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD,

Part Details for MLF2012DR82K by TDK Corporation

Results Overview of MLF2012DR82K by TDK Corporation

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MLF2012DR82K Information

MLF2012DR82K by TDK Corporation is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.

Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.

Price & Stock for MLF2012DR82K

Part # Distributor Description Stock Price Buy
DISTI # 17T6272
Newark Magnetics |Tdk MLF2012DR82K RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel 0
Buy Now
Quest Components 1 ELEMENT, 0.82 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD 1275
  • 1 $0.3980
  • 32 $0.1791
  • 280 $0.1194
$0.1194 / $0.3980 Buy Now
DISTI # MLF2012DR82KT000
TTI RF Inductors - SMD .82 UH 10% pbFree: Pb-Free Min Qty: 2000 Package Multiple: 2000 Container: Reel Americas - 0
  • 2,000 $0.0490
  • 4,000 $0.0480
  • 6,000 $0.0470
  • 10,000 $0.0460
  • 16,000 $0.0460
  • 20,000 $0.0450
$0.0450 / $0.0490 Buy Now

Part Details for MLF2012DR82K

MLF2012DR82K CAD Models

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MLF2012DR82K Part Data Attributes

MLF2012DR82K TDK Corporation
Buy Now Datasheet
Compare Parts:
MLF2012DR82K TDK Corporation General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD,
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TDK CORP
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8504.50.80.00
Samacsys Manufacturer TDK
Core Material FERRITE
DC Resistance 1 Ω
Inductance-Nom (L) 0.82 µH
Inductor Application RF INDUCTOR
Inductor Type GENERAL PURPOSE INDUCTOR
Number of Functions 1
Number of Terminals 2
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Quality Factor-Min (at L-nom) 25
Rated Current-Max 0.15 A
Self Resonance Frequency 100 MHz
Shape/Size Description RECTANGULAR PACKAGE
Shielded YES
Special Feature MULTILAYER
Surface Mount YES
Terminal Placement DUAL ENDED
Terminal Shape WRAPAROUND
Test Frequency 25 MHz
Tolerance 10%

Alternate Parts for MLF2012DR82K

This table gives cross-reference parts and alternative options found for MLF2012DR82K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MLF2012DR82K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
L0805S821K Temex Ceramics Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, SMD, CHIP, 0805 MLF2012DR82K vs L0805S821K
MCI0805HLTER82K KOA Speer Electronics Inc Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD, MLF2012DR82K vs MCI0805HLTER82K
MLF0805-R82K TDK Corporation Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD MLF2012DR82K vs MLF0805-R82K
MCI0805HR82K KOA Speer Electronics Inc Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD, MLF2012DR82K vs MCI0805HR82K
L0805S821K EXXELIA Group Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, SMD, CHIP, 0805 MLF2012DR82K vs L0805S821K
MCI0805HTTER82K KOA Speer Electronics Inc Check for Price General Purpose Inductor, 0.82uH, 10%, 1 Element, Ferrite-Core, SMD, MLF2012DR82K vs MCI0805HTTER82K

MLF2012DR82K Related Parts

MLF2012DR82K Frequently Asked Questions (FAQ)

  • The recommended land pattern for MLF2012DR82K is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.

  • To handle thermal considerations for MLF2012DR82K, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm. The thermal land should be connected to a ground plane or a thermal via to dissipate heat efficiently.

  • The maximum operating temperature range for MLF2012DR82K is -55°C to +125°C. However, the component's performance may degrade at temperatures above 85°C, and it's recommended to operate it within the -40°C to +85°C range for optimal performance.

  • To ensure the reliability of MLF2012DR82K in high-vibration environments, use a robust mounting method such as underfill or potting to secure the component. Additionally, ensure that the PCB is designed with adequate stiffness and that the component is placed in a location that minimizes vibration stress.

  • The recommended reflow soldering profile for MLF2012DR82K is a peak temperature of 260°C, with a dwell time above 220°C of 30-60 seconds. The ramp-up rate should be 3°C/second, and the cooling rate should be 6°C/second.

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