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Part Details for MLF2012D68NMTD25 by TDK Corporation
Results Overview of MLF2012D68NMTD25 by TDK Corporation
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Electronic Manufacturing
MLF2012D68NMTD25 Information
MLF2012D68NMTD25 by TDK Corporation is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.
Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.
Price & Stock for MLF2012D68NMTD25
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
50AJ4246
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Newark | Multilayer Inductor, 0.068Uh, 0.3A, 0805 Rohs Compliant: Yes |Tdk MLF2012D68NMTD25 RoHS: Compliant Min Qty: 10 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 3140 |
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$0.0840 / $0.1090 | Buy Now |
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DISTI #
445-16980-1-ND
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DigiKey | FIXED IND 68NH 300MA 150MOHM SMD Min Qty: 1 Lead time: 15 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
5061 In Stock |
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$0.0604 / $0.1600 | Buy Now |
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DISTI #
MLF2012D68NMTD25
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Avnet Americas | - Tape and Reel (Alt: MLF2012D68NMTD25) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 15 Weeks, 0 Days Container: Reel | 0 |
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$0.0698 / $0.0706 | Buy Now |
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DISTI #
810-MLF2012D68NMTD25
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Mouser Electronics | RF Inductors - SMD 68nH 150mohms 300mA +/-20% Fer AEC-Q200 RoHS: Compliant | 4199 |
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$0.0720 / $0.1600 | Buy Now |
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DISTI #
MLF2012D68NMTD25
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TME | Inductor: ferrite, SMD, 0805, 68nH, 300mA, 150mΩ, ftest: 50MHz, ±20% Min Qty: 4000 | 0 |
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$0.0750 | RFQ |
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DISTI #
MLF2012D68NMTD25
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Avnet Abacus | (Alt: MLF2012D68NMTD25) RoHS: Not Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 19 Weeks, 0 Days | Abacus - 0 |
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Buy Now |
Part Details for MLF2012D68NMTD25
MLF2012D68NMTD25 CAD Models
MLF2012D68NMTD25 Part Data Attributes
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MLF2012D68NMTD25
TDK Corporation
Buy Now
Datasheet
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Compare Parts:
MLF2012D68NMTD25
TDK Corporation
General Purpose Inductor,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TDK CORP | |
| Package Description | CHIP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8504.50.80.00 | |
| Factory Lead Time | 15 Weeks | |
| Samacsys Manufacturer | TDK | |
| Case/Size Code | 0805 | |
| Construction | Rectangular | |
| Core Material | FERRITE | |
| DC Resistance | 0.15 Ω | |
| Inductance-Nom (L) | 0.068 µH | |
| Inductor Application | RF INDUCTOR | |
| Inductor Type | GENERAL PURPOSE INDUCTOR | |
| Number of Functions | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Height | 0.85 mm | |
| Package Length | 2 mm | |
| Package Style | SMT | |
| Package Width | 1.25 mm | |
| Packing Method | TR, PUNCHED PAPER, 7 INCH | |
| Quality Factor-Min (at L-nom) | 15 | |
| Rated Current-Max | 0.3 A | |
| Reference Standard | AEC-Q200 | |
| Self Resonance Frequency | 500 MHz | |
| Shape/Size Description | RECTANGULAR PACKAGE | |
| Shielded | YES | |
| Surface Mount | YES | |
| Terminal Placement | DUAL ENDED | |
| Terminal Shape | WRAPAROUND | |
| Test Frequency | 50 MHz | |
| Tolerance | 20% |
MLF2012D68NMTD25 Frequently Asked Questions (FAQ)
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The recommended land pattern for MLF2012D68NMTD25 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
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To handle thermal considerations for MLF2012D68NMTD25, ensure that the component is placed on a thermal pad or a copper pour on the PCB to dissipate heat. The thermal pad should be connected to a ground plane or a heat sink to improve heat dissipation. Additionally, consider using thermal vias to connect the thermal pad to an inner layer or a heat sink.
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The maximum operating temperature for MLF2012D68NMTD25 is 125°C, as specified in the datasheet. However, it's recommended to derate the component's operating temperature based on the specific application and environmental conditions to ensure reliable operation.
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To ensure the reliability of MLF2012D68NMTD25 in high-vibration environments, consider using a robust PCB design with a sufficient thickness and material selection. Additionally, use a suitable adhesive or underfill material to secure the component to the PCB, and ensure that the component is properly soldered and inspected.
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The recommended soldering profile for MLF2012D68NMTD25 is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/second. However, it's recommended to consult the datasheet and follow the specific soldering profile recommended by TDK Corporation.