Part Details for MK26FN2M0CAC18R by Freescale Semiconductor
Results Overview of MK26FN2M0CAC18R by Freescale Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Communication and Networking
Robotics and Drones
MK26FN2M0CAC18R Information
MK26FN2M0CAC18R by Freescale Semiconductor is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MK26FN2M0CAC18R
MK26FN2M0CAC18R CAD Models
MK26FN2M0CAC18R Part Data Attributes
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MK26FN2M0CAC18R
Freescale Semiconductor
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Datasheet
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MK26FN2M0CAC18R
Freescale Semiconductor
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 2M Flash, 180MHz, WLCSP 169
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 5.60 X 5.50 MM, 0.60 MM HEIGHT, 0.40 MM PITCH, WLCSP-169 | |
| Reach Compliance Code | compliant | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M4F | |
| Clock Frequency-Max | 50 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | R-PBGA-B169 | |
| Length | 5.6 mm | |
| Number of I/O Lines | 116 | |
| Number of Terminals | 169 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA169,13X13,16 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 262144 | |
| ROM (words) | 2097152 | |
| ROM Programmability | FLASH | |
| Speed | 180 MHz | |
| Supply Current-Max | 106.75 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Width | 5.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |