Part Details for MK11DX256VMC5 by Freescale Semiconductor
Results Overview of MK11DX256VMC5 by Freescale Semiconductor
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MK11DX256VMC5 Information
MK11DX256VMC5 by Freescale Semiconductor is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MK11DX256VMC5
MK11DX256VMC5 CAD Models
MK11DX256VMC5 Part Data Attributes
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MK11DX256VMC5
Freescale Semiconductor
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MK11DX256VMC5
Freescale Semiconductor
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 256KB Flash, 50MHz, MAPBGA 121
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | 8 X 8 MM, MAPBGA-121 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M4 | |
Clock Frequency-Max | 50 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B121 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 121 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA121,11X11,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 32768 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Speed | 50 MHz | |
Supply Current-Max | 19.3 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.635 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |