Part Details for MIC7300YMM by Microchip Technology Inc
Results Overview of MIC7300YMM by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MIC7300YMM Information
MIC7300YMM by Microchip Technology Inc is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for MIC7300YMM
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
71Y3052
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Newark | 2.2V, Ittybitty, Op-Amp With High Drive Capability 8 Msop 3X3Mm Tube Rohs Compliant: Yes |Microchip MIC7300YMM RoHS: Compliant Min Qty: 600 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$0.5300 | Buy Now |
DISTI #
MIC7300YMM-ND
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DigiKey | IC OPAMP GP 1 CIRCUIT 8MSOP Min Qty: 1 Lead time: 7 Weeks Container: Tube |
588 In Stock |
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$0.5500 / $0.6800 | Buy Now |
DISTI #
MIC7300YMM
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Avnet Americas | - Rail/Tube (Alt: MIC7300YMM) RoHS: Compliant Min Qty: 600 Package Multiple: 100 Lead time: 7 Weeks, 0 Days Container: Tube | 0 |
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$0.5478 / $0.6006 | Buy Now |
DISTI #
998-MIC7300YMM
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Mouser Electronics | Operational Amplifiers - Op Amps 2.2V, IttyBitty, Op-Amp with High Drive Capability RoHS: Compliant | 0 |
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$0.5500 / $0.6800 | Order Now |
DISTI #
MIC7300YMM
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Microchip Technology Inc | 2.2V, IttyBitty, Op-Amp with High Drive Capability, MSOP, Projected EOL: 2034-02-22 COO: Thailand ECCN: EAR99 RoHS: Compliant Lead time: 7 Weeks, 0 Days Container: Tube |
300 Alternates Available |
|
$0.4900 / $0.6800 | Buy Now |
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Onlinecomponents.com | Op Amp Single GP R-R I/O 10V 8-Pin MSOP Tube RoHS: Compliant | 300 Factory Stock |
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$0.5240 / $0.6570 | Buy Now |
DISTI #
MIC7300YMM
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IBS Electronics | MIC7300 SERIES 10 V 370 KHZ RAIL-TO-RAIL OPERATIONAL AMPLIFIER - MSOP-8 Min Qty: 1700 Package Multiple: 1 | 0 |
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$0.7345 / $0.8060 | Buy Now |
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NAC | 2.2V, IttyBitty, Op-Amp with High Drive Capability - Package: 8 MSOP 3x3mm TUBE RoHS: Compliant Min Qty: 600 Package Multiple: 100 Container: Tube | 0 |
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$0.5500 / $0.6800 | Buy Now |
DISTI #
MIC7300YMM
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Avnet Silica | (Alt: MIC7300YMM) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 9 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MIC7300YMM
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EBV Elektronik | (Alt: MIC7300YMM) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 8 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for MIC7300YMM
MIC7300YMM CAD Models
MIC7300YMM Part Data Attributes
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MIC7300YMM
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
MIC7300YMM
Microchip Technology Inc
OP-AMP, 9000uV OFFSET-MAX, 0.45MHz BAND WIDTH, PDSO8
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | LEAD FREE, MSOP-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 7 Weeks | |
Samacsys Manufacturer | Microchip | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Common-mode Reject Ratio-Min | 50 dB | |
Common-mode Reject Ratio-Nom | 70 dB | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 9000 µV | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 3 mm | |
Low-Bias | YES | |
Low-Offset | NO | |
Micropower | NO | |
Moisture Sensitivity Level | 1 | |
Neg Supply Voltage Limit-Max | ||
Neg Supply Voltage-Nom (Vsup) | ||
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TUBE | |
Peak Reflow Temperature (Cel) | 260 | |
Power | NO | |
Programmable Power | NO | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.09 mm | |
Slew Rate-Nom | 0.5 V/us | |
Supply Current-Max | 4 mA | |
Supply Voltage Limit-Max | 12 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Unity Gain BW-Nom | 450 | |
Voltage Gain-Min | 15000 | |
Wideband | NO | |
Width | 2.97 mm |
MIC7300YMM Frequently Asked Questions (FAQ)
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Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, placing thermal vias under the IC and using a thermal pad on the top layer can help to dissipate heat more efficiently.
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To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
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Microchip recommends using a 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of 10V or higher for the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
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To optimize the output capacitor selection, consider the output voltage ripple, output current, and ESR requirements. A general guideline is to use a 10uF to 47uF X7R or X5R ceramic capacitor with a voltage rating of 10V or higher for the output capacitor. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ensure stable operation.
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Microchip provides a recommended PCB footprint and land pattern in the datasheet, which includes a QFN-16 package with a 3x3 mm body size and 0.5 mm pitch. It's essential to follow this footprint and land pattern to ensure proper soldering and thermal performance.