Datasheets
MCR18EZPF1000 by: ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 100ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Part Details for MCR18EZPF1000 by ROHM Semiconductor

Results Overview of MCR18EZPF1000 by ROHM Semiconductor

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MCR18EZPF1000 Information

MCR18EZPF1000 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.

Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.

Price & Stock for MCR18EZPF1000

Part # Distributor Description Stock Price Buy
DISTI # 87647779
Verical Res Thick Film 1206 100 Ohm 1% 0.25W(1/4W) ±100ppm/°C Pad SMD Automotive T/R Min Qty: 4238 Package Multiple: 1 Date Code: 2150 Americas - 146406
  • 4,238 $0.0279
  • 5,000 $0.0266
  • 10,000 $0.0186
  • 20,000 $0.0139
  • 80,000 $0.0129
$0.0129 / $0.0279 Buy Now
Bristol Electronics   5069
RFQ
Quest Components RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 100 PPM, 100 OHM, SURFACE MOUNT, 1206 3392
  • 1 $0.0990
  • 304 $0.0330
  • 1,516 $0.0198
$0.0198 / $0.0990 Buy Now
Quest Components RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 100 PPM, 100 OHM, SURFACE MOUNT, 1206 663
  • 1 $7.5000
  • 217 $4.1250
  • 486 $3.7500
$3.7500 / $7.5000 Buy Now
DISTI # MCR18EZPF1000
Avnet Abacus SMD Chip Resistor 100 Ohm 1 250 mW 1206 3216 Metric Thick Film General Purpose (Alt: MCR18EZPF1000) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 112 Weeks, 0 Days Abacus - 0
Buy Now
DISTI # MCR18EZPF1000
Chip One Stop Res Thick Film 1206 100 Ohm 1% 0.25W(1/4W) ±100ppm/C Epoxy Resin Pad SMD Automotive T/R RoHS: Compliant pbFree: Yes Min Qty: 50 Lead time: 0 Weeks, 1 Days Container: Cut Tape 146406
  • 50 $0.0279
  • 100 $0.0266
  • 200 $0.0186
  • 500 $0.0139
  • 1,000 $0.0129
  • 2,000 $0.0118
  • 5,000 $0.0101
  • 10,000 $0.0096
  • 20,000 $0.0090
  • 80,000 $0.0080
$0.0080 / $0.0279 Buy Now

Part Details for MCR18EZPF1000

MCR18EZPF1000 CAD Models

MCR18EZPF1000 Part Data Attributes

MCR18EZPF1000 ROHM Semiconductor
Buy Now Datasheet
Compare Parts:
MCR18EZPF1000 ROHM Semiconductor Fixed Resistor, Metal Glaze/thick Film, 0.25W, 100ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ROHM CO LTD
Package Description CHIP
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8533.21.00.30
Samacsys Manufacturer ROHM Semiconductor
Construction Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2
Operating Temperature-Max 155 °C
Operating Temperature-Min -55 °C
Package Height 0.55 mm
Package Length 3.2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Package Width 1.6 mm
Packing Method TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W
Rated Temperature 70 °C
Reference Standard AEC-Q200; IATF 16949
Resistance 100 Ω
Resistor Type FIXED RESISTOR
Size Code 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1%
Working Voltage 200 V

MCR18EZPF1000 Related Parts

MCR18EZPF1000 Frequently Asked Questions (FAQ)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.

  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.

  • Handle the device by the body, not the leads. Avoid bending or twisting the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.

  • Yes, the MCR18EZPF1000 is qualified to the AEC-Q101 standard for automotive applications. However, additional testing and validation may be required for specific high-reliability applications.

  • Use a thermal imaging camera to identify hotspots. Check the PCB layout and thermal design for any issues. Verify that the device is operated within the recommended voltage and current ratings. Consult the datasheet and application notes for troubleshooting guidelines.

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