-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MCP73213T-A6SI/MF by Microchip Technology Inc is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
14R8880
|
Newark | Dual Cell Ovp Battery Charger 10 Dfn 3X3X0.9Mm T/R Rohs Compliant: Yes |Microchip MCP73213T-A6SI/MF RoHS: Compliant Min Qty: 3300 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$1.8800 | Buy Now |
DISTI #
MCP73213T-A6SI/MFCT-ND
|
DigiKey | IC BATT CONTRL LI-ION 2CEL 10DFN Min Qty: 1 Lead time: 7 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
8747 In Stock |
|
$1.8200 / $2.4100 | Buy Now |
DISTI #
MCP73213T-A6SI/MF
|
Avnet Americas | Battery Charge Management Controller Li-Ion/Li-Polymer 8.4V 10-Pin DFN EP T/R - Tape and Reel (Alt: MCP73213T-A6SI/MF) RoHS: Compliant Min Qty: 3300 Package Multiple: 3300 Lead time: 7 Weeks, 0 Days Container: Reel | 0 |
|
$1.8135 / $1.9375 | Buy Now |
DISTI #
579-MCP73213T-A6SIMF
|
Mouser Electronics | Battery Management Dual cell OVP battery charger RoHS: Compliant | 1580 |
|
$1.8200 / $2.4100 | Buy Now |
DISTI #
V72:2272_06454417
|
Arrow Electronics | Linear Battery Charger Controller Li-Ion/Li-Pol 1000mA 8.4V 10-Pin DFN EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 7 Weeks Container: Cut Strips | Americas - 3278 |
|
$1.9880 / $2.2240 | Buy Now |
DISTI #
MCP73213T-A6SI/MF
|
Microchip Technology Inc | Integrated input voltage, dual cell, Li-Ion/Li-Polymer battery device w/6V OVP, DFN, Projected EOL: 2034-07-22 COO: Thailand ECCN: EAR99 RoHS: Compliant Lead time: 7 Weeks, 0 Days Container: Reel |
45 Alternates Available |
|
$1.7300 / $2.4100 | Buy Now |
DISTI #
70452057
|
RS | Dual cell OVP battery charger10 DFN 3x3x0.9mm T/R Min Qty: 3300 Package Multiple: 1 Lead time: 52 Weeks, 0 Days Container: Bulk | 0 |
|
$2.3100 | RFQ |
|
Onlinecomponents.com | Linear Battery Charger Controller Li-Ion/Li-Pol 1000mA 8.4V 10-Pin DFN EP T/R RoHS: Compliant |
3300 In Stock |
|
$1.6300 / $4.6600 | Buy Now |
DISTI #
66292983
|
Verical | Linear Battery Charger Controller Li-Ion/Li-Pol 1000mA 8.4V 10-Pin DFN EP T/R RoHS: Compliant Min Qty: 20 Package Multiple: 10 Date Code: 2246 | Americas - 3300 |
|
$2.7667 / $6.0598 | Buy Now |
DISTI #
88921628
|
Verical | Linear Battery Charger Controller Li-Ion/Li-Pol 1000mA 8.4V 10-Pin DFN EP T/R RoHS: Compliant Min Qty: 3 Package Multiple: 1 | Americas - 3278 |
|
$2.2240 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
MCP73213T-A6SI/MF
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
MCP73213T-A6SI/MF
Microchip Technology Inc
2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | DFN | |
Package Description | 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10 | |
Pin Count | 10 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 7 Weeks | |
Samacsys Manufacturer | Microchip | |
Adjustable Threshold | YES | |
Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT | |
JESD-30 Code | S-PDSO-N10 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Moisture Sensitivity Level | 1 | |
Number of Channels | 2 | |
Number of Functions | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Equivalence Code | SOLCC10,.12,20 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Qualification Status | Not Qualified | |
Screening Level | TS 16949 | |
Seated Height-Max | 1 mm | |
Supply Current-Max (Isup) | 1.5 mA | |
Supply Voltage-Max (Vsup) | 16 V | |
Supply Voltage-Min (Vsup) | 4 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Width | 3 mm |
This table gives cross-reference parts and alternative options found for MCP73213T-A6SI/MF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCP73213T-A6SI/MF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MCP73213T-A6SI-MF | Microchip Technology Inc | Check for Price | 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10 | MCP73213T-A6SI/MF vs MCP73213T-A6SI-MF |
Microchip recommends following a 4-layer PCB stack-up with a solid ground plane, and using a star-configuration for the power and ground connections. Additionally, keep the analog and digital traces separate and avoid crossing them over each other.
To ensure accuracy, use a high-quality external capacitor (e.g., 1uF ceramic) connected between the VREF pin and GND. Also, keep the VREF pin away from noise sources and ensure a low-impedance connection to the capacitor.
Power up the device in the following sequence: VDD, VCC, and then VIN. Ensure that VDD and VCC are powered up simultaneously, and VIN is powered up last. Also, ensure that the input voltage (VIN) is within the recommended operating range.
Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and consider using a thermal interface material (TIM) to improve heat transfer. Also, follow the recommended PCB layout and thermal design guidelines from Microchip.
Use a shielded enclosure, and ensure good grounding and bonding of the PCB and enclosure. Use EMI filters or common-mode chokes on the input and output lines, and follow the recommended PCB layout and routing guidelines to minimize radiation and susceptibility.