Part Details for MCIMX508CZK8B by Freescale Semiconductor
Results Overview of MCIMX508CZK8B by Freescale Semiconductor
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Agriculture Technology
Renewable Energy
Electronic Manufacturing
Robotics and Drones
MCIMX508CZK8B Information
MCIMX508CZK8B by Freescale Semiconductor is a Multifunction Peripheral.
Multifunction Peripherals are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MCIMX508CZK8B
MCIMX508CZK8B CAD Models
MCIMX508CZK8B Part Data Attributes
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MCIMX508CZK8B
Freescale Semiconductor
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Datasheet
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MCIMX508CZK8B
Freescale Semiconductor
i.MX50 32-bit MPU, ARM Cortex-A8 core, 800MHz, POPBGA 416
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | POPBGA-416 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B416 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 416 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA416,24X24,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |