Part Details for MCF54450ACVM180 by Freescale Semiconductor
Results Overview of MCF54450ACVM180 by Freescale Semiconductor
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
MCF54450ACVM180 Information
MCF54450ACVM180 by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MCF54450ACVM180
MCF54450ACVM180 CAD Models
MCF54450ACVM180 Part Data Attributes
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MCF54450ACVM180
Freescale Semiconductor
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Datasheet
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MCF54450ACVM180
Freescale Semiconductor
MCF5445x 32-bit MPU, ColdFire V4 core, 180MHz, MAPBGA 256
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | MAPBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 14 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 17 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Speed | 180 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |