Datasheets
MCAC60N10Y-TP by: Micro Commercial Components

Power Field-Effect Transistor, 60A I(D), 100V, 0.0086ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DFN5060-8

Part Details for MCAC60N10Y-TP by Micro Commercial Components

Results Overview of MCAC60N10Y-TP by Micro Commercial Components

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MCAC60N10Y-TP Information

MCAC60N10Y-TP by Micro Commercial Components is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for MCAC60N10Y-TP

Part # Distributor Description Stock Price Buy
DISTI # 353-MCAC60N10Y-TPCT-ND
DigiKey MOSFET N-CH 100 60A DFN5060 Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) 15249
In Stock
  • 1 $1.8400
  • 10 $1.1700
  • 100 $0.7870
  • 500 $0.6227
  • 1,000 $0.5727
  • 5,000 $0.4679
$0.4679 / $1.8400 Buy Now
DISTI # 833-MCAC60N10Y-TP
Mouser Electronics MOSFETs N-CHANNEL MOSFET RoHS: Compliant 0
  • 5,000 $0.4670
$0.4670 Order Now
Future Electronics N-Channel 100 V 60 A 7.2 mOhm 88 W Surface Mount MOSFET - DFN5060 Min Qty: 5000 Package Multiple: 5000 5000
null
  • 5,000 $0.4600
$0.4600 Buy Now
Vyrian Transistors 10202
RFQ

Part Details for MCAC60N10Y-TP

MCAC60N10Y-TP Part Data Attributes

MCAC60N10Y-TP Micro Commercial Components
Buy Now Datasheet
Compare Parts:
MCAC60N10Y-TP Micro Commercial Components Power Field-Effect Transistor, 60A I(D), 100V, 0.0086ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DFN5060-8
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS CORP
Package Description DFN5060-8
Reach Compliance Code not_compliant
ECCN Code EAR99
Samacsys Manufacturer MCC
Avalanche Energy Rating (Eas) 200 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 60 A
Drain-source On Resistance-Max 0.0086 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 32 pF
JESD-30 Code R-PDSO-F8
Number of Elements 1
Number of Terminals 8
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 88 W
Pulsed Drain Current-Max (IDM) 240 A
Surface Mount YES
Terminal Form FLAT
Terminal Position DUAL
Transistor Element Material SILICON

MCAC60N10Y-TP Frequently Asked Questions (FAQ)

  • The recommended land pattern for the MCAC60N10Y-TP can be found in the Micro Commercial Components' application note or on their website. It typically includes a pad layout and dimensions for optimal soldering and thermal performance.

  • Proper thermal management is crucial for the MCAC60N10Y-TP. Ensure good thermal conductivity by using a heat sink, thermal interface material, and a well-designed PCB layout. Follow the recommended thermal design guidelines in the datasheet or application notes.

  • The maximum operating temperature range for the MCAC60N10Y-TP is typically specified in the datasheet as -55°C to 150°C. However, it's essential to check the specific datasheet for the exact temperature range, as it may vary depending on the package and application.

  • The MCAC60N10Y-TP may not be suitable for high-reliability or aerospace applications without additional screening and qualification. Check with Micro Commercial Components for their high-reliability or aerospace-grade equivalent parts, which may have undergone additional testing and screening.

  • Follow the recommended soldering profile and guidelines in the datasheet or application notes. Ensure proper soldering techniques, such as using a soldering iron with a temperature-controlled tip, and avoid overheating or over-soldering, which can cause damage to the device.

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