Part Details for MC9S08SH32MTJR by Freescale Semiconductor
Results Overview of MC9S08SH32MTJR by Freescale Semiconductor
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
MC9S08SH32MTJR Information
MC9S08SH32MTJR by Freescale Semiconductor is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MC9S08SH32MTJR
MC9S08SH32MTJR CAD Models
MC9S08SH32MTJR Part Data Attributes
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MC9S08SH32MTJR
Freescale Semiconductor
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Datasheet
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MC9S08SH32MTJR
Freescale Semiconductor
MICROCONTROLLER
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | TSSOP-20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 8 | |
| CPU Family | HCS08 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e3 | |
| Length | 6.5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 18 | |
| Number of Terminals | 20 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP20,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 1024 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Speed | 40 MHz | |
| Supply Current-Max | 10 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 4.4 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |