Part Details for MC8641DVJ1333JE by NXP Semiconductors
Results Overview of MC8641DVJ1333JE by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
MC8641DVJ1333JE Information
MC8641DVJ1333JE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC8641DVJ1333JE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8670
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Newark | 32-Bit Power Architecture Soc, 2 X 1333Mhz, Ddr1/2, Altivec, Gbe, Pci-E, Srio, 0 To 105C, Rev 3/ Tray Rohs Compliant: Yes |Nxp MC8641DVJ1333JE RoHS: Compliant Min Qty: 24 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$632.3400 / $670.9600 | Buy Now |
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DISTI #
89490928
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Verical | MPU PowerPC MPC8xxx Processor RISC 32bit 0.09um 1.333GHz 1.05V/1.1V/1.8V/2.5V/3.3V 1023-Pin FCCBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1601 | Americas - 20 |
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$635.1375 / $721.7375 | Buy Now |
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Flip Electronics | Stock, ship today | 11736 |
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RFQ |
Part Details for MC8641DVJ1333JE
MC8641DVJ1333JE CAD Models
MC8641DVJ1333JE Part Data Attributes
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MC8641DVJ1333JE
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC8641DVJ1333JE
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-1023 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B1023 | |
| JESD-609 Code | e2 | |
| Length | 33 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1023 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.77 mm | |
| Speed | 1333 MHz | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 1 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 33 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MC8641DVJ1333JE
This table gives cross-reference parts and alternative options found for MC8641DVJ1333JE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC8641DVJ1333JE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MC8641DHX1333JB | Freescale Semiconductor | Check for Price | 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | MC8641DVJ1333JE vs MC8641DHX1333JB |
| MC8641DVU1333JB | Freescale Semiconductor | Check for Price | 32-BIT, 166.66MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | MC8641DVJ1333JE vs MC8641DVU1333JB |
| MC8641VU1333JB | Freescale Semiconductor | Check for Price | 32-BIT, 166.66MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | MC8641DVJ1333JE vs MC8641VU1333JB |
| MC8641HX1333JB | Freescale Semiconductor | Check for Price | 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | MC8641DVJ1333JE vs MC8641HX1333JB |
| MC8641HX1333JE | Freescale Semiconductor | Check for Price | 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | MC8641DVJ1333JE vs MC8641HX1333JE |
MC8641DVJ1333JE Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management guide in the MC8641DVJ1333JE application note (AN5071). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
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The MC8641DVJ1333JE has multiple power modes. To configure optimal power management, refer to the device's power management chapter in the datasheet and application note (AN5071). You can also use NXP's Power Management IC (PMIC) design tool to help with configuration.
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NXP recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, placed as close as possible to the device's power pins. Refer to the datasheet and application note (AN5071) for more information.
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For clocking and timing issues, refer to the device's clocking and timing chapter in the datasheet. You can also use NXP's Clocking and Timing Tool to help with configuration and troubleshooting.
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The MC8641DVJ1333JE has a maximum junction temperature (Tj) of 150°C. Derating factors are provided in the datasheet, and you should consider these when designing your system to ensure reliable operation.