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MC812A4CPVE8
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MC812A4CPVE8 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
62K5020
|
Newark | |Nxp MC812A4CPVE8 RoHS: Compliant Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$30.9800 | Buy Now |
DISTI #
MC812A4CPVE8-ND
|
DigiKey | IC MCU 16BIT 4KB EEPROM 112LQFP Min Qty: 1 Lead time: 13 Weeks Container: Tray |
1221 In Stock |
|
$32.5135 / $46.6600 | Buy Now |
DISTI #
MC812A4CPVE8
|
Avnet Americas | 16 Bit Microcontroller, Low Power High Speed, HC08 Family HC08AP Series Microcontrollers, HC12 - Trays (Alt: MC812A4CPVE8) RoHS: Compliant Min Qty: 60 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 75 |
|
$27.9976 / $28.9472 | Buy Now |
DISTI #
841-MC812A4CPVE8
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Mouser Electronics | 16-bit Microcontrollers - MCU 16BMCU 1KRAM 4K EEPROM RoHS: Compliant | 1108 |
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$33.0700 / $44.8700 | Buy Now |
DISTI #
E02:0323_00009137
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Arrow Electronics | MCU 16-bit CPU12 CISC 5V 112-Pin LQFP Tray RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 13 Weeks Date Code: 2448 | Europe - 60 |
|
$31.0839 / $33.1494 | Buy Now |
DISTI #
V36:1790_07185732
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Arrow Electronics | MCU 16-bit CPU12 CISC 5V 112-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks Date Code: 2442 | Americas - 52 |
|
$29.4500 / $44.4600 | Buy Now |
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Future Electronics | MC812A4 Series 1 kB RAM 16-Bit Low Power High Speed Microcontroller - LQFP-112 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks Container: Tray | 3558Tray |
|
$28.1800 / $29.5900 | Buy Now |
DISTI #
83592227
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Verical | MCU 16-bit CPU12 CISC 5V 112-Pin LQFP Tray RoHS: Compliant Min Qty: 2 Package Multiple: 1 | Americas - 297 |
|
$25.6000 / $29.5000 | Buy Now |
DISTI #
87142705
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Verical | MCU 16-bit CPU12 CISC 5V 112-Pin LQFP Tray RoHS: Compliant Min Qty: 60 Package Multiple: 60 Date Code: 2431 | Americas - 60 |
|
$53.8313 | Buy Now |
DISTI #
87483603
|
Verical | MCU 16-bit CPU12 CISC 5V 112-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2442 | Americas - 52 |
|
$29.4500 / $44.4600 | Buy Now |
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MC812A4CPVE8
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC812A4CPVE8
NXP Semiconductors
MC812A4CPVE8
|
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Date Of Intro | 1996-04-01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | 22 | |
Bit Size | 16 | |
Clock Frequency-Max | 16 MHz | |
DMA Channels | NO | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PQFP-G112 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 93 | |
Number of Terminals | 112 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP112,.87SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 1024 | |
ROM (words) | 4096 | |
ROM Programmability | EEPROM | |
Speed | 8 MHz | |
Supply Current-Max | 65 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (TJ) and adjust the system design accordingly.
Use a minimum of 2-3 decoupling capacitors (10nF, 100nF, and 1uF) placed close to the device. Implement a pi-filter or LC-filter for power supply noise reduction.
Use the device's power-saving modes (e.g., sleep, standby), optimize clock frequencies, and minimize I/O switching activity. Consider using a low-dropout regulator (LDO) for power supply.
Implement a shielded enclosure, use a common-mode choke, and ensure proper PCB layout and grounding. Follow IEC 61000-4-2 and CISPR 24 standards for EMC and EMI compliance.