Part Details for MC68EN360ZQ25VL by NXP Semiconductors
Results Overview of MC68EN360ZQ25VL by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
MC68EN360ZQ25VL Information
MC68EN360ZQ25VL by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC68EN360ZQ25VL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86010250
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Verical | MPU ColdFire M683xx Processor RISC 32bit 0.57um 25MHz 357-Pin BGA Tray RoHS: Not Compliant Min Qty: 34 Package Multiple: 1 Date Code: 1301 | Americas - 136 |
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$11.1000 | Buy Now |
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Rochester Electronics | QUICC Communications Controller, CMOS, PBGA357 RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 136 |
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$7.8100 / $8.8800 | Buy Now |
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Flip Electronics | Stock | 47 |
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RFQ |
Part Details for MC68EN360ZQ25VL
MC68EN360ZQ25VL CAD Models
MC68EN360ZQ25VL Part Data Attributes
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MC68EN360ZQ25VL
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC68EN360ZQ25VL
NXP Semiconductors
10Mbps, SERIAL COMM CONTROLLER, PBGA357
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA-357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Additional Feature | ALSO OPERATES AT 3.3 V | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Bus Compatibility | SCC, SMC, SPI, UART | |
| Clock Frequency-Max | 33.34 MHz | |
| Communication Protocol | ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC | |
| Data Encoding/Decoding Method | NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER) | |
| Data Transfer Rate-Max | 1.25 MBps | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 16 | |
| Number of Serial I/Os | 6 | |
| Number of Terminals | 357 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 2560 | |
| Seated Height-Max | 1.86 mm | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | HCMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Alternate Parts for MC68EN360ZQ25VL
This table gives cross-reference parts and alternative options found for MC68EN360ZQ25VL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC68EN360ZQ25VL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MC68EN360VR25VL | NXP Semiconductors | Check for Price | 32-BIT, 33MHz, RISC PROCESSOR, PBGA257 | MC68EN360ZQ25VL vs MC68EN360VR25VL |
MC68EN360ZQ25VL Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout guide in their application note AN1231, which includes guidelines for thermal vias, heat sink attachment, and component placement to minimize thermal resistance.
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A reliable POR circuit can be implemented using an external voltage supervisor IC, such as the NXP PCA6420, which provides a reset signal to the microcontroller during power-up and brownout conditions.
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To ensure EMC and EMI compliance, follow NXP's guidelines for PCB layout, component selection, and shielding. Additionally, consider using EMI filters, such as the NXP PCA6421, and implementing electromagnetic shielding techniques.
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To optimize flash memory endurance, use the microcontroller's built-in flash wear leveling and error correction mechanisms. Additionally, implement a software-based wear leveling algorithm, and consider using a flash memory with a higher endurance rating, such as the NXP P-Flash.
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The MC68EN360ZQ25VL's operating temperature range (-40°C to 125°C) requires careful consideration of thermal management, component selection, and system design to ensure reliability and prevent overheating. Use thermal simulation tools and follow NXP's thermal design guidelines to ensure a reliable system design.