Part Details for MC35XS3500HFK by NXP Semiconductors
Results Overview of MC35XS3500HFK by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Aerospace and Defense
Automotive
MC35XS3500HFK Information
MC35XS3500HFK by NXP Semiconductors is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MC35XS3500HFK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8632
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Newark | High-Side Switch, 12V, Penta 35Mohms, Pqfn 24/ Tray Rohs Compliant: Yes |Nxp MC35XS3500HFK RoHS: Compliant Min Qty: 840 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$4.4000 | Buy Now |
Part Details for MC35XS3500HFK
MC35XS3500HFK CAD Models
MC35XS3500HFK Part Data Attributes
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MC35XS3500HFK
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC35XS3500HFK
NXP Semiconductors
BUF OR INV BASED PRPHL DRVR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| Driver Number of Bits | 5 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | S-PQCC-N24 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC24(UNSPEC) | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
MC35XS3500HFK Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management guide in their application note AN12255. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
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To minimize power consumption, configure the device to use the lowest possible voltage and frequency for your application. Use the power-saving modes (e.g., sleep, standby) when the device is not in use. Additionally, optimize your firmware to reduce current consumption during active modes.
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To ensure EMI and EMC compliance, follow NXP's guidelines for PCB layout, component selection, and shielding. Use a metal shield can or a shielded enclosure to reduce emissions. Additionally, implement EMI filters and ferrite beads on the power lines to reduce conducted emissions.
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Use NXP's development tools, such as the MCUXpresso IDE, to debug and troubleshoot issues. Enable debug logs and use the built-in debugging features to identify and isolate problems. Consult the device's errata sheet and application notes for known issues and workarounds.
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Implement secure boot mechanisms, such as secure boot with encryption, to prevent unauthorized access. Use secure communication protocols (e.g., HTTPS, TLS) and encrypt sensitive data. Regularly update the device's firmware and software to ensure you have the latest security patches.