Part Details for MC34PF3001A7EPR2 by NXP Semiconductors
Results Overview of MC34PF3001A7EPR2 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
MC34PF3001A7EPR2 Information
MC34PF3001A7EPR2 by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MC34PF3001A7EPR2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
62Y5881
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Newark | Power Management Ic, I.mx7, Pre-Prog, 3 Buck, 6 Ldo, Qfn 48/ Reel Rohs Compliant: Yes |Nxp MC34PF3001A7EPR2 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$2.8100 / $3.4300 | Buy Now |
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DISTI #
MC34PF3001A7EPR2-ND
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DigiKey | POWER MANAGEMENT IC I.MX7 PRE- Min Qty: 4000 Lead time: 16 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$3.0482 | Buy Now |
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DISTI #
MC34PF3001A7EPR2
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Avnet Americas | Power Management, 5.5 V, 3 Step-Down DC-DC Converters, 6 LDOs, 9 Regulated Outputs, 48 Pins, HVQFN - Tape and Reel (Alt: MC34PF3001A7EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$2.8896 / $2.9498 | Buy Now |
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DISTI #
841-MC34PF3001A7EPR2
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48 RoHS: Compliant | 0 |
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$3.0400 | Order Now |
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DISTI #
MC34PF3001A7EPR2
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Avnet Silica | Power Management 55 V 3 StepDown DCDC Converters 6 LDOs 9 Regulated Outputs 48 Pins HVQFN (Alt: MC34PF3001A7EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MC34PF3001A7EPR2
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EBV Elektronik | Power Management 55 V 3 StepDown DCDC Converters 6 LDOs 9 Regulated Outputs 48 Pins HVQFN (Alt: MC34PF3001A7EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MC34PF3001A7EPR2
MC34PF3001A7EPR2 CAD Models
MC34PF3001A7EPR2 Part Data Attributes
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MC34PF3001A7EPR2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC34PF3001A7EPR2
NXP Semiconductors
POWER SUPPLY SUPPORT CKT
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | QFN-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Date Of Intro | 2016-03-03 | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N48 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 10 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
MC34PF3001A7EPR2 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. NXP provides a recommended PCB layout in their application notes.
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To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering, and ensure proper grounding. NXP provides EMC guidelines in their application notes and datasheet.
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The input capacitor should be a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF. The output capacitor should be a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10 μF to 22 μF.
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The POR and BOR features can be handled by connecting the POR pin to a capacitor and a resistor to the VCC pin. The BOR threshold can be adjusted by connecting a resistor divider network to the BOR pin.
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Thermal management is crucial for this device. Ensure good airflow, use a heat sink if necessary, and follow proper PCB design guidelines to minimize thermal resistance. The device's thermal shutdown feature can also be used to prevent overheating.