Part Details for MC34PF3001A1EP by NXP Semiconductors
Results Overview of MC34PF3001A1EP by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
MC34PF3001A1EP Information
MC34PF3001A1EP by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MC34PF3001A1EP
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
62Y5868
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Newark | Power Management Ic, I.mx7, Pre-Prog, 3 Buck, 6 Ldo, Qfn 48/ Tray Rohs Compliant: Yes |Nxp MC34PF3001A1EP RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.8900 / $4.0000 | Buy Now |
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DISTI #
568-14634-ND
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DigiKey | IC POWER MANAGEMENT 48QFN Min Qty: 1 Lead time: 16 Weeks Container: Tray |
260 In Stock |
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$4.2033 / $7.1500 | Buy Now |
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DISTI #
MC34PF3001A1EP
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Avnet Americas | Power Management Integrated Circuit 48-Pin QFN EP Tray - Trays (Alt: MC34PF3001A1EP) RoHS: Compliant Min Qty: 1040 Package Multiple: 260 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3.7344 / $3.8122 | Buy Now |
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DISTI #
841-MC34PF3001A1EP
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48 RoHS: Compliant | 232 |
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$4.0500 / $7.1500 | Buy Now |
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DISTI #
MC34PF3001A1EP
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Avnet Silica | Power Management Integrated Circuit 48Pin QFN EP Tray (Alt: MC34PF3001A1EP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MC34PF3001A1EP
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EBV Elektronik | Power Management Integrated Circuit 48Pin QFN EP Tray (Alt: MC34PF3001A1EP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Other Function Semiconductors | 245 |
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RFQ |
Part Details for MC34PF3001A1EP
MC34PF3001A1EP CAD Models
MC34PF3001A1EP Part Data Attributes
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MC34PF3001A1EP
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC34PF3001A1EP
NXP Semiconductors
POWER SUPPLY SUPPORT CKT
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | QFN-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Date Of Intro | 2016-03-03 | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N48 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 10 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
MC34PF3001A1EP Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, ensuring good thermal conductivity. A 2-layer or 4-layer PCB with a solid ground plane can help dissipate heat efficiently. Additionally, keeping the device away from other heat sources and using thermal vias can improve thermal performance.
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To ensure EMC, follow proper PCB design guidelines, such as using a solid ground plane, minimizing loop areas, and keeping sensitive traces away from noisy signals. Additionally, use shielding, filtering, and grounding techniques to reduce electromagnetic interference (EMI).
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For soldering, use a reflow profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. For rework, use a hot air station with a temperature range of 200-250°C (392-482°F) and a dwell time of 10-20 seconds. Always follow the manufacturer's recommended soldering and rework guidelines.
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To troubleshoot issues, start by reviewing the datasheet and application notes. Check the power supply, input voltage, and output current. Verify that the device is properly configured and that the PCB layout is correct. Use oscilloscopes and logic analyzers to debug the issue. If the problem persists, contact NXP Semiconductors' technical support for further assistance.
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Operating the MC34PF3001A1EP beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to follow the recommended operating conditions to ensure the device functions as intended and to avoid potential damage or malfunction.