Part Details for MC34903CS3EK by Freescale Semiconductor
Results Overview of MC34903CS3EK by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
MC34903CS3EK Information
MC34903CS3EK by Freescale Semiconductor is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for MC34903CS3EK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC34903CS3EK-ND
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DigiKey | SYSTEM BASIS CHIP, LIN, 2X 3.3 V Min Qty: 76 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
76 In Stock |
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$4.6300 | Buy Now |
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Rochester Electronics | System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32 RoHS: Compliant Status: Obsolete Min Qty: 1 | 76 |
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$3.5600 / $4.4500 | Buy Now |
Part Details for MC34903CS3EK
MC34903CS3EK CAD Models
MC34903CS3EK Part Data Attributes
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MC34903CS3EK
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MC34903CS3EK
Freescale Semiconductor
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32, Rail
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Length | 11 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.45 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | SUPPORT CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7.5 mm |