Part Details for MC33PF3000A4ESR2 by NXP Semiconductors
Results Overview of MC33PF3000A4ESR2 by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
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MC33PF3000A4ESR2 Information
MC33PF3000A4ESR2 by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MC33PF3000A4ESR2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
01AC9245
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Newark | Power Management Ic, I.mx7, Pre-Prog, 4 Buck, 6 Ldo, 1 Boost, Auto, Qfn 48/ Reel Rohs Compliant: Yes |Nxp MC33PF3000A4ESR2 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.2300 | Buy Now |
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DISTI #
MC33PF3000A4ESR2-ND
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DigiKey | POWER MANAGEMENT IC I.MX7 PRE- Min Qty: 4000 Lead time: 16 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$4.7145 | Buy Now |
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DISTI #
MC33PF3000A4ESR2
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Avnet Americas | MC33PF3000A4ES/HVQFN48/REEL 13 - Tape and Reel (Alt: MC33PF3000A4ESR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$4.1939 / $4.3361 | Buy Now |
|
DISTI #
841-MC33PF3000A4ESR2
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 4 buck, 6 LDO, 1 boost, Auto, QFN 48 RoHS: Compliant | 0 |
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$4.6500 | Order Now |
Part Details for MC33PF3000A4ESR2
MC33PF3000A4ESR2 CAD Models
MC33PF3000A4ESR2 Part Data Attributes
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MC33PF3000A4ESR2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC33PF3000A4ESR2
NXP Semiconductors
Power Supply Support Circuit, Adjustable, 12 Channel, MOS
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | QFN-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N48 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 12 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
MC33PF3000A4ESR2 Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout in the MC33PF3000A4ESR2 application note (AN12213) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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The MC33PF3000A4ESR2 has multiple power modes (e.g., low-power mode, shutdown mode) that can be configured using the device's registers. NXP provides a detailed description of the power modes and configuration procedures in the device's user manual (UM11224).
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The MC33PF3000A4ESR2 has a high power dissipation rating, and proper thermal management is crucial to ensure reliable operation. NXP recommends using a thermal pad or heat sink, and provides thermal resistance values and thermal management guidelines in the device's datasheet and application note (AN12213).
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NXP provides a troubleshooting guide for I2C interface issues in the device's user manual (UM11224), which includes steps to check for proper I2C bus configuration, clock stretching, and data transmission errors. Additionally, NXP's I2C bus analyzer tool can be used to debug I2C communication issues.
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The MC33PF3000A4ESR2 has built-in electrostatic discharge (ESD) protection and latch-up prevention mechanisms. NXP recommends following proper handling and storage procedures to prevent ESD damage, and provides guidelines for ESD protection and latch-up prevention in the device's datasheet and application note (AN12213).