Datasheets
MC33CD1030AER2 by: NXP Semiconductors

Interface Circuit

Part Details for MC33CD1030AER2 by NXP Semiconductors

Results Overview of MC33CD1030AER2 by NXP Semiconductors

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

MC33CD1030AER2 Information

MC33CD1030AER2 by NXP Semiconductors is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for MC33CD1030AER2

Part # Distributor Description Stock Price Buy
DISTI # 11AC3407
Newark Switch Detect Interface, -40 To 125Deg C, Ic Interface Type:Spi, Interface Applications:Multiple Switch Detection Interface, Supply Voltage Min:3V, Supply Voltage Max:5.25V, Interface Case Style:Lqfp-Ep, No. Of Pins:48Pins Rohs Compliant: Yes |Nxp MC33CD1030AER2 RoHS: Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 500 $3.0300
$3.0300 Buy Now
DISTI # MC33CD1030AER2
Avnet Americas Multiple Switch Detection Interface IC, 3 V to 5.25 V, 48 Pins, LQFP-EP - Tape and Reel (Alt: MC33CD1030AER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 12 Weeks, 0 Days Container: Reel 0
  • 2,000 $2.7794
  • 4,000 $2.7566
  • 8,000 $2.7337
  • 12,000 $2.7110
  • 16,000 $2.6883
$2.6883 / $2.7794 Buy Now
DISTI # 841-MC33CD1030AER2
Mouser Electronics Interface - Specialized 33 channel, Mono, 48 RoHS: Compliant 745
  • 1 $5.5000
  • 10 $4.2100
  • 25 $3.8900
  • 100 $3.5300
  • 250 $3.3600
  • 500 $3.2600
  • 1,000 $3.1800
  • 2,000 $2.8400
$2.8400 / $5.5000 Buy Now
DISTI # MC33CD1030AER2
Avnet Silica Multiple Switch Detection Interface IC 3 V to 525 V 48 Pins LQFPEP (Alt: MC33CD1030AER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 14 Weeks, 0 Days Silica - 0
Buy Now
DISTI # MC33CD1030AER2
EBV Elektronik Multiple Switch Detection Interface IC 3 V to 525 V 48 Pins LQFPEP (Alt: MC33CD1030AER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 14 Weeks, 0 Days EBV - 0
Buy Now
Win Source Electronics IC INTERFACE SPECIALIZED 48LQFP / Switch Monitoring Interface 48-HLQFP (7x7) 4500
  • 13 $4.7242
  • 27 $4.4195
  • 41 $4.2670
  • 59 $3.9623
  • 76 $3.8099
  • 95 $3.6576
$3.6576 / $4.7242 Buy Now

Part Details for MC33CD1030AER2

MC33CD1030AER2 CAD Models

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MC33CD1030AER2 Part Data Attributes

MC33CD1030AER2 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MC33CD1030AER2 NXP Semiconductors Interface Circuit
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer NXP
Interface IC Type INTERFACE CIRCUIT
JESD-30 Code S-PQFP-G48
Length 7 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HLFQFP
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max 36 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 16 V
Surface Mount YES
Technology SMARTMOS
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm

MC33CD1030AER2 Related Parts

MC33CD1030AER2 Frequently Asked Questions (FAQ)

  • A good PCB layout for the MC33CD1030AER2 involves placing the device near the power source, using a solid ground plane, and keeping the input and output traces short and separate to minimize noise and EMI.

  • To ensure proper power-up and initialization, follow the recommended power-up sequence, ensure the input voltage is within the specified range, and add a capacitor to the EN pin to prevent unwanted resets.

  • The MC33CD1030AER2 has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink for high-power applications.

  • To troubleshoot issues, check the input voltage, output voltage, and current consumption. Use an oscilloscope to verify the switching frequency and output waveform. Consult the datasheet and application notes for guidance on specific issues.

  • Yes, the MC33CD1030AER2 is qualified for automotive and high-reliability applications. However, ensure that the device is used within its specified operating conditions, and follow the recommended design and manufacturing guidelines for these applications.

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