Part Details for MC33662BLEFR2 by NXP Semiconductors
Results Overview of MC33662BLEFR2 by NXP Semiconductors
- Distributor Offerings: (13 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Electronic Manufacturing
Automotive
MC33662BLEFR2 Information
MC33662BLEFR2 by NXP Semiconductors is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for MC33662BLEFR2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
79AH4040
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Newark | Transceiver, Physical Layer, Lin 2.1/Saej2602-2, 20Kbps, tx/Rx Symmetry, Soic 8 Rohs Compliant: Yes |Nxp MC33662BLEFR2 RoHS: Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 17500 |
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$0.8640 | Buy Now |
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DISTI #
61AC0257
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Newark | Lin Transceiver, 20Kbaud, Nsoic-8, Output Voltage:-, Output Current:-, Supply Voltage Min:7V, Supply Voltage Max:18V, Baud Rate:-, Interface Case Style:Nsoic, No. Of Pins:8Pins, Product Range:-, Automotive Qualification Standard:-, Rohs Compliant: Yes |Nxp MC33662BLEFR2 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 405 |
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$0.8870 / $1.7100 | Buy Now |
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DISTI #
11AC3455
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Newark | Transceiver, Physical Layer, Lin 2.1/Saej2602-2, 20Kbps, tx/Rx Symmetry, Soic 8/ Reel Rohs Compliant: Yes |Nxp MC33662BLEFR2 RoHS: Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.8160 / $0.8290 | Buy Now |
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DISTI #
568-MC33662BLEFR2CT-ND
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DigiKey | IC TRANSCEIVER 1/1 8SOIC Min Qty: 1 Lead time: 26 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
23020 In Stock |
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$0.8451 / $1.7400 | Buy Now |
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DISTI #
MC33662BLEFR2
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Avnet Americas | LIN Transceiver, 20 Kbaud, 7V to 18V Supply, 0.9V to 5.25V RXD, 0.8V to 2V TXD, NSOIC-8 - Tape and Reel (Alt: MC33662BLEFR2) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 26 Weeks, 0 Days Container: Reel | 17500 |
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$0.7405 / $0.7657 | Buy Now |
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DISTI #
841-MC33662BLEFR2
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Mouser Electronics | LIN Transceivers Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20 kbps, TX/RX symmetry, SOIC 8 RoHS: Compliant | 2017 |
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$0.8330 / $1.7400 | Buy Now |
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DISTI #
75724425
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Verical | LIN Transceiver with Integrated Vreg 3.3V/5V 20kBd 8-Pin SOIC N T/R Automotive AEC-Q100 RoHS: Compliant Min Qty: 35 Package Multiple: 1 Date Code: 2344 | Americas - 2397 |
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$0.9290 / $1.8200 | Buy Now |
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NXP Semiconductors | Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20 kbps, TX/RX symmetry, SOIC 8, Reel 13" Q1/T1 in Drypack RoHS: Compliant pbFree: Yes Lead time: 26 Weeks, 0 Days Container: Reel | 3216 |
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$0.6900 / $0.8200 | Buy Now |
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Chip 1 Exchange | INSTOCK | 2200 |
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RFQ | |
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DISTI #
MC33662BLEFR2
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Avnet Silica | LIN Transceiver 20 Kbaud 7V to 18V Supply 09V to 525V RXD 08V to 2V TXD NSOIC8 (Alt: MC33662BLEFR2) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for MC33662BLEFR2
MC33662BLEFR2 CAD Models
MC33662BLEFR2 Part Data Attributes
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MC33662BLEFR2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC33662BLEFR2
NXP Semiconductors
DATACOM, INTERFACE CIRCUIT, PDSO8
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | ROHS COMPLIANT, MS-012AA, SOIC-8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 26 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Nom | 13.5 V | |
| Surface Mount | YES | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 3.9 mm |
MC33662BLEFR2 Frequently Asked Questions (FAQ)
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A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note (AN) or a thermal simulation tool can help optimize the design.
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Follow the guidelines in the datasheet and application notes for PCB layout, component selection, and shielding. Additionally, perform EMC testing and simulation to ensure compliance with relevant standards.
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NXP provides a test and measurement guide, which includes procedures for characterizing the device's electrical and thermal performance. Additionally, use industry-standard test equipment and follow best practices for measurement setup and data analysis.
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Implement external OVP and OCP circuits, such as zener diodes and current-sensing resistors, to protect the device from voltage and current surges. The datasheet provides some guidance, but additional design considerations and simulations may be necessary.
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Use thermal interface materials, heat sinks, and fans to manage heat generation. Perform thermal simulations and testing to ensure the device operates within its thermal specifications. Consider using a thermal design tool to optimize the design.