Part Details for MC32PF3001A1EP by NXP Semiconductors
Results Overview of MC32PF3001A1EP by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
MC32PF3001A1EP Information
MC32PF3001A1EP by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MC32PF3001A1EP
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
62Y5854
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Newark | Power Management Ic, I.mx7, Pre-Prog, 3 Buck, 6 Ldo, Qfn 48/ Tray Rohs Compliant: Yes |Nxp MC32PF3001A1EP RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.4800 / $3.5900 | Buy Now |
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DISTI #
568-14633-ND
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DigiKey | POWER MANAGEMENT IC I.MX7 PRE- Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$3.5246 / $6.2300 | Buy Now |
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DISTI #
MC32PF3001A1EP
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Avnet Americas | Power Management Integrated Circuit 48-Pin QFN EP Tray - Trays (Alt: MC32PF3001A1EP) RoHS: Compliant Min Qty: 1040 Package Multiple: 260 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$2.9812 / $3.5042 | Buy Now |
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DISTI #
841-MC32PF3001A1EP
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Mouser Electronics | Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48 RoHS: Compliant | 999 |
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$3.5700 / $6.3500 | Buy Now |
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DISTI #
MC32PF3001A1EP
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Avnet Silica | Power Management Integrated Circuit 48Pin QFN EP Tray (Alt: MC32PF3001A1EP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MC32PF3001A1EP
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EBV Elektronik | Power Management Integrated Circuit 48Pin QFN EP Tray (Alt: MC32PF3001A1EP) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MC32PF3001A1EP
MC32PF3001A1EP CAD Models
MC32PF3001A1EP Part Data Attributes
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MC32PF3001A1EP
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC32PF3001A1EP
NXP Semiconductors
POWER SUPPLY SUPPORT CKT
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | QFN-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Date Of Intro | 2016-03-03 | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | INTEGRATED POWER MANAGEMENT UNIT | |
| JESD-30 Code | S-XQCC-N48 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 10 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 4.5 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
MC32PF3001A1EP Frequently Asked Questions (FAQ)
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A good PCB layout for the MC32PF3001A1EP involves placing the device near the antenna, using a solid ground plane, and minimizing the length of the RF traces. A 4-layer PCB with a dedicated ground plane is recommended. NXP provides a reference design and layout guidelines in their application notes.
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Optimizing the antenna design involves selecting the right antenna type, size, and placement. A quarter-wave monopole antenna or a dipole antenna is recommended. The antenna should be placed at least 10mm away from the device and other components. NXP provides antenna design guidelines and simulation models in their application notes.
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The MC32PF3001A1EP has an operating temperature range of -40°C to 85°C. However, the device can be operated at temperatures up to 105°C for short periods of time. It's essential to ensure proper thermal management and heat dissipation to prevent overheating.
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NXP provides a secure boot mechanism and firmware update process for the MC32PF3001A1EP. Implementing secure boot involves generating a secure boot key, creating a secure boot image, and configuring the device to use the secure boot mechanism. NXP provides detailed guidelines and software tools for secure boot and firmware updates.
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The MC32PF3001A1EP has a typical current consumption of 10mA in receive mode and 20mA in transmit mode. The device requires a power supply voltage of 1.8V to 3.6V. It's essential to ensure a stable power supply and to follow NXP's power management guidelines to minimize power consumption.