Part Details for MC26LS30DG by onsemi
Results Overview of MC26LS30DG by onsemi
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC26LS30DG Information
MC26LS30DG by onsemi is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MC26LS30DG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MC26LS30DG
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Avnet Americas | - Rail/Tube (Alt: MC26LS30DG) RoHS: Not Compliant Min Qty: 432 Package Multiple: 48 Lead time: 111 Weeks, 0 Days Container: Tube | 0 |
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RFQ |
Part Details for MC26LS30DG
MC26LS30DG CAD Models
MC26LS30DG Part Data Attributes
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MC26LS30DG
onsemi
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Datasheet
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MC26LS30DG
onsemi
Dual Differential (EIA-422-A)/Quad Single Ended (EIA-423-A) Line Driver, SOIC 16 LEAD, 48-TUBE
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| Pbfree Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SOIC 16 LEAD | |
| Package Description | SOIC-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | 751B-05 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | onsemi | |
| Additional Feature | FOUR SINGLE ENDED DRIVERS OR TWO DIFFERENTIAL DRIVERS | |
| Differential Output | NO | |
| Driver Number of Bits | 4 | |
| High Level Input Current-Max | 0.00004 A | |
| Input Characteristics | STANDARD | |
| Interface IC Type | LINE DRIVER | |
| Interface Standard | EIA-422-A; EIA-423-A | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e3 | |
| Length | 9.9 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Out Swing-Min | 2 V | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Transmit Delay-Max | 300 ns | |
| Width | 3.9 mm |
MC26LS30DG Frequently Asked Questions (FAQ)
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A good PCB layout for the MC26LS30DG should consider the following: keep the input and output traces short and symmetrical, use a solid ground plane, and place decoupling capacitors close to the device. Additionally, ensure that the PCB material has a low dielectric constant to minimize signal reflections.
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To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The input voltage (VIN) should be within the recommended range (typically 0.5V to VCC-0.5V). Also, ensure that the input impedance is matched to the device's input impedance (typically 50 ohms).
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The maximum operating frequency of the MC26LS30DG is typically around 100 MHz, but it can vary depending on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information on frequency limitations.
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To handle ESD protection, ensure that the device is handled and stored in an ESD-safe environment. Use ESD-protective packaging and handling materials, and consider adding external ESD protection devices (such as TVS diodes) to the PCB design.
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The MC26LS30DG has a maximum junction temperature (TJ) of 150°C. To ensure proper thermal management, use a heat sink or thermal pad on the device, and ensure good airflow around the PCB. Also, consider using thermal vias and thermal layers in the PCB design to dissipate heat effectively.