Datasheets
MC15XS3400DHFK by:

4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24

Part Details for MC15XS3400DHFK by NXP Semiconductors

Results Overview of MC15XS3400DHFK by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

MC15XS3400DHFK Information

MC15XS3400DHFK by NXP Semiconductors is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for MC15XS3400DHFK

Part # Distributor Description Stock Price Buy
DISTI # 89T6110
Newark High-Side Switch, 12V, Quad 15Mohms, Pqfn 24/ Tray Rohs Compliant: Yes |Nxp MC15XS3400DHFK RoHS: Compliant Min Qty: 840 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 500 $4.9400
$4.9400 Buy Now
Rochester Electronics High-Side Switch, 12V, Quad 15mOhms, PQFN 24 RoHS: Compliant Status: Obsolete Min Qty: 1 8
  • 25 $4.7700
  • 100 $4.5300
  • 500 $4.3000
  • 1,000 $4.0600
  • 10,000 $3.8200
$3.8200 / $4.7700 Buy Now

Part Details for MC15XS3400DHFK

MC15XS3400DHFK Part Data Attributes

MC15XS3400DHFK NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MC15XS3400DHFK NXP Semiconductors 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 12 X 12 MM, 2.10 HEIGHT, 0.90 PITCH, ROHS COMPLIANT, PQFN-24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES WITH 4 TO 28 VOLTS
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits 4
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code S-XBCC-B24
Length 12 mm
Moisture Sensitivity Level 3
Number of Functions 4
Number of Terminals 24
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK
Package Body Material UNSPECIFIED
Package Code HBCC
Package Equivalence Code LCC24(UNSPEC)
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max 20 V
Supply Voltage-Min 6 V
Supply Voltage-Nom 12 V
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Form BUTT
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Turn-off Time 90 µs
Turn-on Time 90 µs
Width 12 mm

MC15XS3400DHFK Related Parts

MC15XS3400DHFK Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.

  • The internal oscillator's frequency is 16 MHz, with a tolerance of ±1%. The startup time is 10 ms, and the oscillator stability is ±100 ppm over the operating temperature range.

  • Use the device's low-power modes (e.g., Wait, Stop, and VLLS0) whenever possible. Optimize your code to minimize CPU usage and use peripherals with low power consumption.

  • Use 100 nF and 10 μF decoupling capacitors, placed as close as possible to the device's power pins. Ensure a low-ESR capacitor for the 10 μF capacitor.

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