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4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MC15XS3400DHFK by NXP Semiconductors is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
89T6110
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Newark | High-Side Switch, 12V, Quad 15Mohms, Pqfn 24/ Tray Rohs Compliant: Yes |Nxp MC15XS3400DHFK RoHS: Compliant Min Qty: 840 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$4.9400 | Buy Now |
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Rochester Electronics | High-Side Switch, 12V, Quad 15mOhms, PQFN 24 RoHS: Compliant Status: Obsolete Min Qty: 1 | 8 |
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$3.8200 / $4.7700 | Buy Now |
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MC15XS3400DHFK
NXP Semiconductors
Buy Now
Datasheet
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MC15XS3400DHFK
NXP Semiconductors
4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 12 X 12 MM, 2.10 HEIGHT, 0.90 PITCH, ROHS COMPLIANT, PQFN-24 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
Additional Feature | ALSO OPERATES WITH 4 TO 28 VOLTS | |
Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | |
Driver Number of Bits | 4 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | S-XBCC-B24 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 4 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Current Flow Direction | SINK | |
Package Body Material | UNSPECIFIED | |
Package Code | HBCC | |
Package Equivalence Code | LCC24(UNSPEC) | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.2 mm | |
Supply Voltage-Max | 20 V | |
Supply Voltage-Min | 6 V | |
Supply Voltage-Nom | 12 V | |
Surface Mount | YES | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | BUTT | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Turn-off Time | 90 µs | |
Turn-on Time | 90 µs | |
Width | 12 mm |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
The internal oscillator's frequency is 16 MHz, with a tolerance of ±1%. The startup time is 10 ms, and the oscillator stability is ±100 ppm over the operating temperature range.
Use the device's low-power modes (e.g., Wait, Stop, and VLLS0) whenever possible. Optimize your code to minimize CPU usage and use peripherals with low power consumption.
Use 100 nF and 10 μF decoupling capacitors, placed as close as possible to the device's power pins. Ensure a low-ESR capacitor for the 10 μF capacitor.