Part Details for MC10XSC425EK by NXP Semiconductors
Results Overview of MC10XSC425EK by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Automotive
Robotics and Drones
MC10XSC425EK Information
MC10XSC425EK by NXP Semiconductors is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MC10XSC425EK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MC10XSC425EK
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Avnet Americas | Power Switch Hi Side 6A 32-Pin SOIC EP Rail - Rail/Tube (Alt: MC10XSC425EK) RoHS: Compliant Min Qty: 42 Package Multiple: 42 Lead time: 111 Weeks, 0 Days Container: Tube | 0 |
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RFQ | |
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DISTI #
89493252
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Verical | Power Switch Hi Side 32-Pin SOIC W EP Tube Min Qty: 58 Package Multiple: 1 Date Code: 1301 | Americas - 84 |
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$5.2625 / $6.5750 | Buy Now |
Part Details for MC10XSC425EK
MC10XSC425EK CAD Models
MC10XSC425EK Part Data Attributes
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MC10XSC425EK
NXP Semiconductors
Buy Now
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MC10XSC425EK
NXP Semiconductors
BUF OR INV BASED PRPHL DRVR
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Driver Number of Bits | 4 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP32,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 |