Part Details for MC100EP51DR2G by onsemi
Results Overview of MC100EP51DR2G by onsemi
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Aerospace and Defense
MC100EP51DR2G Information
MC100EP51DR2G by onsemi is an FF/Latch.
FF/Latches are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for MC100EP51DR2G
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
42K0434
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Newark | Ic, flip-Flop, single, d Type, ecl100,sop,8Pin, plastic Rohs Compliant: Yes |Onsemi MC100EP51DR2G RoHS: Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$9.0300 | Buy Now |
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DISTI #
488-MC100EP51DR2GCT-ND
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DigiKey | IC FF D-TYPE SINGLE 1BIT 8-SOIC Min Qty: 1 Lead time: 28 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
2468 In Stock |
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$9.4854 / $16.3800 | Buy Now |
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DISTI #
MC100EP51DR2G
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Avnet Americas | Flip Flop, MC100EP51, D, 450 ps, 3 GHz, 50 mA, 8 Pins, NSOIC - Tape and Reel (Alt: MC100EP51DR2G) RoHS: Compliant Min Qty: 76 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 2500 Partner Stock |
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$8.2099 / $9.2708 | Buy Now |
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DISTI #
MC100EP51DR2G
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Avnet Americas | Flip Flop, MC100EP51, D, 450 ps, 3 GHz, 50 mA, 8 Pins, NSOIC - Tape and Reel (Alt: MC100EP51DR2G) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 28 Weeks, 0 Days Container: Reel | 2500 Factory Stock |
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$9.0337 / $9.7286 | Buy Now |
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DISTI #
863-MC100EP51DR2G
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Mouser Electronics | Flip Flops 3.3V/5V ECL D-Type w/Reset and Diff Clk RoHS: Compliant | 0 |
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$9.4900 | Order Now |
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Onlinecomponents.com | Flip Flop D-Primary-Secondary Type Pos-Edge/Neg-Edge 1-Element 8-Pin SOIC N T/R RoHS: Compliant | 0 |
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$9.6200 / $28.2300 | Buy Now |
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DISTI #
85996379
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Verical | Flip Flop D-Master-Slave Type Pos-Edge/Neg-Edge 1-Element 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 31 Package Multiple: 1 Date Code: 2201 | Americas - 5879 |
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$9.9625 / $12.4500 | Buy Now |
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Rochester Electronics | MC100EP51 - D Flip-Flop, 100E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8 RoHS: Compliant Status: Active Min Qty: 1 | 5879 |
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$7.9700 / $9.9600 | Buy Now |
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DISTI #
MC100EP51DR2G
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Avnet Silica | Flip Flop MC100EP51 D 450 ps 3 GHz 50 mA 8 Pins NSOIC (Alt: MC100EP51DR2G) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 29 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 2500 |
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RFQ |
Part Details for MC100EP51DR2G
MC100EP51DR2G CAD Models
MC100EP51DR2G Part Data Attributes
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MC100EP51DR2G
onsemi
Buy Now
Datasheet
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Compare Parts:
MC100EP51DR2G
onsemi
ECL D Flip-Flop with Reset and Differential Clock, SOIC-8 Narrow Body, 2500-REEL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SOIC-8 Narrow Body | |
| Pin Count | 8 | |
| Manufacturer Package Code | 751-07 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | onsemi | |
| Additional Feature | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V | |
| Family | 100E | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Max Frequency@Nom-Sup | 3000000000 Hz | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Polarity | COMPLEMENTARY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supply Current-Max (ICC) | 47 mA | |
| Prop. Delay@Nom-Sup | 0.5 ns | |
| Propagation Delay (tpd) | 0.45 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | ECL | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Trigger Type | POSITIVE EDGE | |
| Width | 3.9 mm |
Alternate Parts for MC100EP51DR2G
This table gives cross-reference parts and alternative options found for MC100EP51DR2G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC100EP51DR2G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MC100EP51DR2 | onsemi | Check for Price | 100E SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, SOIC-8 | MC100EP51DR2G vs MC100EP51DR2 |
| MC100EP51D | onsemi | Check for Price | IC 100E SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, SOIC-8, FF/Latch | MC100EP51DR2G vs MC100EP51D |
MC100EP51DR2G Frequently Asked Questions (FAQ)
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A good PCB layout for the MC100EP51DR2G involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure reliable operation of the MC100EP51DR2G in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within its recommended operating temperature range.
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The MC100EP51DR2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
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The MC100EP51DR2G is not specifically designed or tested for radiation hardness, and its performance in such environments is not guaranteed. If radiation hardness is required, a different device should be selected.
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The recommended power sequencing for the MC100EP51DR2G is to apply the power supply voltage (VCC) before the input signals, and to ensure that the power supply voltage is stable before applying the input signals.