Part Details for MC100EP31DR2G by onsemi
Results Overview of MC100EP31DR2G by onsemi
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
MC100EP31DR2G Information
MC100EP31DR2G by onsemi is an FF/Latch.
FF/Latches are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for MC100EP31DR2G
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
86124922
|
Verical | Flip Flop D-Master-Slave Type Pos-Edge 1-Element 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 66 Package Multiple: 1 | Americas - 9042 |
|
$4.5875 / $5.7375 | Buy Now |
|
DISTI #
86124897
|
Verical | Flip Flop D-Master-Slave Type Pos-Edge 1-Element 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 66 Package Multiple: 1 Date Code: 1201 | Americas - 9006 |
|
$4.5875 / $5.7375 | Buy Now |
|
|
Rochester Electronics | D Flip-Flop, 100E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8 RoHS: Compliant Status: Obsolete Min Qty: 1 | 18048 |
|
$3.6700 / $4.5900 | Buy Now |
Part Details for MC100EP31DR2G
MC100EP31DR2G CAD Models
MC100EP31DR2G Part Data Attributes
|
|
MC100EP31DR2G
onsemi
Buy Now
Datasheet
|
Compare Parts:
MC100EP31DR2G
onsemi
ECL D Flip-Flop with Set and Reset, SOIC-8 Narrow Body, 2500-REEL
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SOIC | |
| Package Description | LEAD FREE, SOIC-8 | |
| Pin Count | 8 | |
| Manufacturer Package Code | 751-07 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | onsemi | |
| Additional Feature | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V | |
| Family | 100E | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Max Frequency@Nom-Sup | 3000000000 Hz | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Polarity | COMPLEMENTARY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supply Current-Max (ICC) | 47 mA | |
| Propagation Delay (tpd) | 0.41 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | ECL | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Trigger Type | POSITIVE EDGE | |
| Width | 3.9 mm |
Alternate Parts for MC100EP31DR2G
This table gives cross-reference parts and alternative options found for MC100EP31DR2G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC100EP31DR2G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SY10EP51VZG | Microchip Technology Inc | Check for Price | D Flip-Flop, 10E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8, LEAD FREE, PLASTIC, SOIC-8 | MC100EP31DR2G vs SY10EP51VZG |
| MC100EP51DR2G | onsemi | Check for Price | ECL D Flip-Flop with Reset and Differential Clock, SOIC-8 Narrow Body, 2500-REEL | MC100EP31DR2G vs MC100EP51DR2G |
| MC100LVEL31D | Motorola Mobility LLC | Check for Price | 100LVEL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, SOIC-8 | MC100EP31DR2G vs MC100LVEL31D |
| MC100LVEL51D | Motorola Mobility LLC | Check for Price | 100LVEL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, SOIC-8 | MC100EP31DR2G vs MC100LVEL51D |
| SY10EP51VZI | Microchip Technology Inc | Check for Price | D Flip-Flop, 10E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8, PLASTIC, SOIC-8 | MC100EP31DR2G vs SY10EP51VZI |
| MC100LVEL31D | onsemi | Check for Price | 100LVEL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, SOIC-8 | MC100EP31DR2G vs MC100LVEL31D |
| MC100EP35D | onsemi | Check for Price | 100E SERIES, POSITIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, SOIC-8 | MC100EP31DR2G vs MC100EP35D |
| SY10EP51VZG-TR | Micrel Inc | Check for Price | D Flip-Flop, 10E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8, LEAD FREE, PLASTIC, SOIC-8 | MC100EP31DR2G vs SY10EP51VZG-TR |
| SY10EP51VZCTR | Micrel Inc | Check for Price | D Flip-Flop, 10E Series, 1-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDSO8, PLASTIC, SOIC-8 | MC100EP31DR2G vs SY10EP51VZCTR |
| MC100LVEL31DR2 | onsemi | Check for Price | 100LVEL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8, SOIC-8 | MC100EP31DR2G vs MC100LVEL31DR2 |
MC100EP31DR2G Frequently Asked Questions (FAQ)
-
A good PCB layout for the MC100EP31DR2G should consider signal integrity, power supply decoupling, and thermal management. Keep the signal traces short and away from noise sources, use a solid ground plane, and decouple the power supply with capacitors. Also, ensure good thermal conductivity by using a thermal pad and connecting it to a heat sink or a thermal via.
-
The MC100EP31DR2G has a high power dissipation, so thermal management is crucial. Use a thermal pad on the bottom of the package, and connect it to a heat sink or a thermal via. Ensure good airflow around the device, and consider using a thermal interface material (TIM) to improve heat transfer. Monitor the junction temperature (Tj) and ensure it stays within the recommended operating range.
-
The MC100EP31DR2G has built-in ESD protection, but it's still important to handle the device with care. Use an ESD wrist strap or mat, and ensure the workspace is ESD-safe. Avoid touching the device pins or handling it by the leads. When storing or shipping the device, use ESD-safe packaging materials.
-
The MC100EP31DR2G is not specifically designed or tested for radiation-hardened applications. If you need a radiation-hardened device, consider using a different part that is specifically designed and qualified for such applications.
-
The MC100EP31DR2G has a Pb-free package, so use a Pb-free soldering process with a peak temperature of 260°C (500°F) or less. Follow the recommended soldering profile and ensure the device is not exposed to excessive thermal stress during the soldering process.