Part Details for MC100EP16VCDG by onsemi
Results Overview of MC100EP16VCDG by onsemi
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MC100EP16VCDG Information
MC100EP16VCDG by onsemi is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MC100EP16VCDG
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85995288
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Verical | Single Transmitter/Receiver 8-Pin SOIC N Tube RoHS: Compliant Min Qty: 77 Package Multiple: 1 Date Code: 1001 | Americas - 14497 |
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$3.9375 / $4.9250 | Buy Now |
DISTI #
85992457
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Verical | Single Transmitter/Receiver 8-Pin SOIC N Tube RoHS: Compliant Min Qty: 77 Package Multiple: 1 Date Code: 1801 | Americas - 14468 |
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$3.9375 / $4.9250 | Buy Now |
DISTI #
85995373
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Verical | Single Transmitter/Receiver 8-Pin SOIC N Tube RoHS: Compliant Min Qty: 77 Package Multiple: 1 Date Code: 1301 | Americas - 13720 |
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$3.9375 / $4.9250 | Buy Now |
DISTI #
86000765
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Verical | Single Transmitter/Receiver 8-Pin SOIC N Tube RoHS: Compliant Min Qty: 77 Package Multiple: 1 | Americas - 814 |
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$3.9375 / $4.9250 | Buy Now |
DISTI #
86003686
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Verical | Single Transmitter/Receiver 8-Pin SOIC N Tube RoHS: Compliant Min Qty: 77 Package Multiple: 1 Date Code: 0601 | Americas - 482 |
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$3.9375 / $4.9250 | Buy Now |
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Rochester Electronics | Line Transceiver, 1 Driver, 1 Rcvr, ECL, PDSO8 RoHS: Compliant Status: Obsolete Min Qty: 1 | 67795 |
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$3.1500 / $3.9400 | Buy Now |
DISTI #
MC100EP16VCDG
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EBV Elektronik | 33V 5V ECL DIFFERENTIAL RECEIVERDRIVER WITH HIGH GAIN AND ENABLE OUTPUT (Alt: MC100EP16VCDG) RoHS: Compliant Min Qty: 98 Package Multiple: 98 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MC100EP16VCDG
MC100EP16VCDG CAD Models
MC100EP16VCDG Part Data Attributes
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MC100EP16VCDG
onsemi
Buy Now
Datasheet
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Compare Parts:
MC100EP16VCDG
onsemi
Differential Driver / Receiver with High Gain and Enable Output, SOIC-8 Narrow Body, 98-TUBE
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SOIC | |
Package Description | LEAD FREE, SOIC-8 | |
Pin Count | 8 | |
Manufacturer Package Code | 751-07 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | onsemi | |
Additional Feature | CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE | |
Differential Output | YES | |
Driver Number of Bits | 1 | |
High Level Input Current-Max | 0.00015 A | |
Input Characteristics | DIFFERENTIAL | |
Interface IC Type | LINE TRANSCEIVER | |
Interface Standard | GENERAL PURPOSE | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Receive Delay-Max | 0.4 ns | |
Receiver Number of Bits | 1 | |
Seated Height-Max | 1.75 mm | |
Supply Current-Max | 38 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | ECL | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transmit Delay-Max | 0.4 ns | |
Width | 3.9 mm |
Alternate Parts for MC100EP16VCDG
This table gives cross-reference parts and alternative options found for MC100EP16VCDG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC100EP16VCDG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MC100EP16VCDT | onsemi | Check for Price | LINE TRANSCEIVER, PDSO8, PLASTIC, TSSOP-8 | MC100EP16VCDG vs MC100EP16VCDT |
MC100EP16VCDTG | onsemi | Check for Price | Differential Driver / Receiver with High Gain and Enable Output, TSSOP 8 3.0x3.0x0.95 mm, 100-TUBE | MC100EP16VCDG vs MC100EP16VCDTG |
MC100EP16VCDTR2 | onsemi | Check for Price | LINE TRANSCEIVER, PDSO8, PLASTIC, TSSOP-8 | MC100EP16VCDG vs MC100EP16VCDTR2 |
MC100EP16VCDG Frequently Asked Questions (FAQ)
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The recommended operating voltage range for the MC100EP16VCDG is 3.0V to 5.5V, with a typical operating voltage of 3.3V or 5.0V.
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To ensure signal integrity, it is recommended to use a low-impedance PCB design, minimize trace lengths, and use termination resistors as close to the device as possible. Additionally, consider using a signal integrity analysis tool to simulate and optimize the design.
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The MC100EP16VCDG supports data rates up to 2.5 Gbps, making it suitable for high-speed applications such as Gigabit Ethernet, Fibre Channel, and PCI Express.
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It is recommended to sequence the power supply to the MC100EP16VCDG in the following order: VCC, then VEE. This ensures that the device is properly powered up and minimizes the risk of latch-up or damage.
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The MC100EP16VCDG has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, consider using thermal vias and heat sinks to further improve thermal management.