Part Details for MC06XSD200FK by NXP Semiconductors
Results Overview of MC06XSD200FK by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
MC06XSD200FK Information
MC06XSD200FK by NXP Semiconductors is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MC06XSD200FK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
96W1164
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Newark | High-Side Switch, 36V, Dual 6Mohms, Pqfn23/ Tray Rohs Compliant: Yes |Nxp MC06XSD200FK RoHS: Compliant Min Qty: 168 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$11.7200 / $13.8700 | Buy Now |
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DISTI #
MC06XSD200FK
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Avnet Americas | Power Switch Hi Side 9A 23-Pin PQFN Tray - Trays (Alt: MC06XSD200FK) RoHS: Compliant Min Qty: 168 Package Multiple: 168 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
MC06XSD200FK
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EBV Elektronik | Power Switch Hi Side 9A 23Pin PQFN Tray (Alt: MC06XSD200FK) RoHS: Compliant Min Qty: 168 Package Multiple: 168 Lead time: 32 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MC06XSD200FK
MC06XSD200FK CAD Models
MC06XSD200FK Part Data Attributes
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MC06XSD200FK
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC06XSD200FK
NXP Semiconductors
BUF OR INV BASED PRPHL DRVR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | NXP | |
| Driver Number of Bits | 2 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | S-PQCC-N23 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 23 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current-Max | 0.0022 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC23(UNSPEC) | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
Alternate Parts for MC06XSD200FK
This table gives cross-reference parts and alternative options found for MC06XSD200FK. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC06XSD200FK, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MC06XSD200FKR2 | NXP Semiconductors | Check for Price | IC,PERIPHERAL DRIVER,2 DRIVER,BICMOS,LLCC,23PIN,PLASTIC | MC06XSD200FK vs MC06XSD200FKR2 |
MC06XSD200FK Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and voltage ratings according to the datasheet's thermal derating curves.
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The MC06XSD200FK has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
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Yes, the MC06XSD200FK is qualified for automotive and high-reliability applications. However, it's essential to follow NXP's specific guidelines for these applications, including additional testing, validation, and qualification procedures.
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NXP provides a range of debugging tools and resources, including application notes, user manuals, and development boards. Additionally, consider using oscilloscopes, logic analyzers, and other debugging tools to identify and isolate issues. Consult NXP's support resources and documentation for specific guidance.