Part Details for MADP-000165-01340W by TE Connectivity
Results Overview of MADP-000165-01340W by TE Connectivity
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Communication and Networking
Entertainment and Gaming
Robotics and Drones
MADP-000165-01340W Information
MADP-000165-01340W by TE Connectivity is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for MADP-000165-01340W
MADP-000165-01340W CAD Models
MADP-000165-01340W Part Data Attributes
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MADP-000165-01340W
TE Connectivity
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Datasheet
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MADP-000165-01340W
TE Connectivity
SILICON, PIN DIODE, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-1
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TYCO ELECTRONICS M/A-COM | |
| Package Description | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-1 | |
| Pin Count | 1 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.40 | |
| Additional Feature | LOW DISTORTION | |
| Application | ATTENUATOR; SWITCHING | |
| Case Connection | CATHODE | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.06 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 2.5 Ω | |
| Diode Type | PIN DIODE | |
| JESD-30 Code | S-CUUC-N1 | |
| Minority Carrier Lifetime-Nom | 0.2 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 1 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |