Part Details for MADP-000165-01340W by MACOM
Results Overview of MADP-000165-01340W by MACOM
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
MADP-000165-01340W Information
MADP-000165-01340W by MACOM is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for MADP-000165-01340W
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1465-1067-ND
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DigiKey | RF DIODE PIN 200V DIE Min Qty: 1200 Lead time: 16 Weeks Container: Bulk | Temporarily Out of Stock |
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$1.9875 | Buy Now |
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DISTI #
937-MADP00016501340W
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Mouser Electronics | PIN Diodes Vr=200Vdc Trr=20nS Rs@10mA 2.5ohms RoHS: Compliant | 1200 |
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$1.7700 / $1.8400 | Buy Now |
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DISTI #
32825359
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Verical | Diode PIN Attenuator/Switch 200V 2-Pin RoHS: Compliant Min Qty: 100 Package Multiple: 100 Date Code: 1913 | Americas - 1000 |
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$1.7500 | Buy Now |
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DISTI #
MADP-000165-013
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Richardson RFPD | RF PIN DIODE RoHS: Compliant Min Qty: 1200 | 1000 |
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$1.7000 | Buy Now |
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ES Components | MACOM MADP-000165-01340W BARE DIE | 314 in Stock |
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RFQ |
Part Details for MADP-000165-01340W
MADP-000165-01340W CAD Models
MADP-000165-01340W Part Data Attributes
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MADP-000165-01340W
MACOM
Buy Now
Datasheet
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MADP-000165-01340W
MACOM
Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-1
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | M/A-COM TECHNOLOGY SOLUTIONS INC | |
| Pin Count | 1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.40 | |
| Samacsys Manufacturer | MACOM | |
| Additional Feature | LOW DISTORTION | |
| Application | SWITCHING | |
| Breakdown Voltage-Min | 200 V | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.06 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 2.5 Ω | |
| Diode Res Test Current | 10 mA | |
| Diode Res Test Frequency | 500 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | ULTRA HIGH FREQUENCY | |
| JESD-30 Code | S-CUUC-N1 | |
| Minority Carrier Lifetime-Nom | 0.2 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 1 | |
| Operating Temperature-Max | 175 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
MADP-000165-01340W Frequently Asked Questions (FAQ)
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MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal management system.
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The MADP-000165-01340W requires a bias tee or a DC block to provide the necessary voltage and current. A typical biasing scheme includes a voltage source, a resistor, and a capacitor. Consult the application note or contact MACOM support for specific guidance.
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The MADP-000165-01340W can handle up to 2W of input power. Exceeding this limit may cause permanent damage to the device. Ensure that the input power is within the specified range to maintain reliability and performance.
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Common issues can be caused by improper biasing, inadequate thermal management, or poor PCB layout. Check the biasing scheme, ensure proper heat dissipation, and verify the PCB layout against MACOM's recommendations. Consult the application note or contact MACOM support for further assistance.
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Follow MACOM's recommended soldering and assembly procedures, which include using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point above 217°C. Avoid exposing the device to excessive heat, moisture, or mechanical stress.