Part Details for MAAP-011140-DIE by MACOM
Results Overview of MAAP-011140-DIE by MACOM
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Telecommunications
MAAP-011140-DIE Information
MAAP-011140-DIE by MACOM is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for MAAP-011140-DIE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1465-1781-ND
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DigiKey | IC RF AMP 27.5GHZ-30GHZ DIE Min Qty: 100 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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Part Details for MAAP-011140-DIE
MAAP-011140-DIE CAD Models
MAAP-011140-DIE Part Data Attributes
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MAAP-011140-DIE
MACOM
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Datasheet
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MAAP-011140-DIE
MACOM
Wide Band High Power Amplifier,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | M/A-COM TECHNOLOGY SOLUTIONS INC | |
| Reach Compliance Code | compliant | |
| Characteristic Impedance | 50 Ω | |
| Construction | COMPONENT | |
| Gain | 22 dB | |
| Input Power-Max (CW) | 24 dBm | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Functions | 1 | |
| Number of Terminals | 18 | |
| Operating Frequency-Max | 30000 MHz | |
| Operating Frequency-Min | 27500 MHz | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Equivalence Code | DIE OR CHIP | |
| Power Supplies | 6 V | |
| RF/Microwave Device Type | WIDE BAND HIGH POWER | |
| Surface Mount | YES | |
| Technology | PHEMT | |
| VSWR-Max | 1.67 |
MAAP-011140-DIE Frequently Asked Questions (FAQ)
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MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the die to dissipate heat. A thermal pad on the bottom of the package is also recommended for heat sinking.
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MACOM recommends using a resistive divider network to set the bias voltage, and a shunt resistor to stabilize the bias current. The optimal bias point can be determined through simulation and measurement.
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MACOM recommends using a pi-network or a T-network for input and output matching, with component values optimized for the specific application frequency and impedance.
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MACOM recommends handling the die in an ESD-controlled environment, using ESD-protective packaging and tools, and following proper grounding and wrist-strap procedures.
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MACOM performs a range of reliability tests, including temperature cycling, humidity testing, and electrical overstress testing, to ensure the die meets industry standards for reliability and performance.