Part Details for M95160-MN3TP/S by STMicroelectronics
Results Overview of M95160-MN3TP/S by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M95160-MN3TP/S Information
M95160-MN3TP/S by STMicroelectronics is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for M95160-MN3TP/S
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | EEPROM, 2KX8, SERIAL, CMOS, PDSO8 | 1307 |
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$0.4375 / $1.0500 | Buy Now |
Part Details for M95160-MN3TP/S
M95160-MN3TP/S CAD Models
M95160-MN3TP/S Part Data Attributes
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M95160-MN3TP/S
STMicroelectronics
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Datasheet
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M95160-MN3TP/S
STMicroelectronics
2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | SOIC | |
Package Description | 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 5 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 4.9 mm | |
Memory Density | 16384 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.75 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000002 A | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 3.9 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for M95160-MN3TP/S
This table gives cross-reference parts and alternative options found for M95160-MN3TP/S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M95160-MN3TP/S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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M95160-MN3T/S | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | M95160-MN3TP/S vs M95160-MN3T/S |
M95160-MN3P/W | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8 | M95160-MN3TP/S vs M95160-MN3P/W |
M95160-MN3P/G | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8 | M95160-MN3TP/S vs M95160-MN3P/G |
M95160-MN3TP/G | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8 | M95160-MN3TP/S vs M95160-MN3TP/G |
M95160-MN6TP | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8 | M95160-MN3TP/S vs M95160-MN6TP |
M95160-MN5T | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | M95160-MN3TP/S vs M95160-MN5T |
M95160-MN3P | STMicroelectronics | Check for Price | 2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8 | M95160-MN3TP/S vs M95160-MN3P |
M95160-MN3TP/S Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN1011, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
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The M95160-MN3TP/S has a built-in POR and BOR circuitry. To handle these, ensure that the power supply ramps up slowly (typically 10 ms) and that the voltage stays above the minimum operating voltage (VCC) during operation. You can also use external circuitry to filter out noise and ensure a clean power-on sequence.
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The maximum operating frequency for the M95160-MN3TP/S is 16 MHz. As the frequency increases, power consumption also increases. To minimize power consumption, consider using a lower frequency or implementing power-saving modes, such as sleep or standby, when the device is not actively processing data.
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Implement a robust power-down sequence that saves critical data to non-volatile memory before powering down. Use the device's built-in features, such as the battery-backed RAM (BBR) and the power-down controller, to ensure data integrity. Additionally, consider using external circuitry, such as a supercapacitor or battery, to maintain power to the device during short power-down events.
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The M95160-MN3TP/S has a maximum junction temperature (TJ) of 150°C. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal pad. Also, minimize power consumption and avoid high-frequency operation to reduce heat generation.