Datasheets
M68AW512ML70ND6 by:

512KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44

Part Details for M68AW512ML70ND6 by STMicroelectronics

Results Overview of M68AW512ML70ND6 by STMicroelectronics

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M68AW512ML70ND6 Information

M68AW512ML70ND6 by STMicroelectronics is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for M68AW512ML70ND6

Part # Distributor Description Stock Price Buy
DISTI # M68AW512ML70ND6
Avnet Silica SRAM Chip Async Single 33V 8MBit 512K x 16 70ns 44Pin TSOPII (Alt: M68AW512ML70ND6) RoHS: Not Compliant Min Qty: 135 Package Multiple: 135 Lead time: 143 Weeks, 0 Days Silica - 0
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Part Details for M68AW512ML70ND6

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M68AW512ML70ND6 Part Data Attributes

M68AW512ML70ND6 STMicroelectronics
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M68AW512ML70ND6 STMicroelectronics 512KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code TSOP2
Package Description PLASTIC, TSOP2-44
Pin Count 44
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 70 ns
JESD-30 Code R-PDSO-G44
JESD-609 Code e0
Length 18.41 mm
Memory Density 8388608 bit
Memory IC Type STANDARD SRAM
Memory Width 16
Number of Functions 1
Number of Terminals 44
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for M68AW512ML70ND6

This table gives cross-reference parts and alternative options found for M68AW512ML70ND6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M68AW512ML70ND6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
M68AW512ML70ND1T STMicroelectronics Check for Price 512KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs M68AW512ML70ND1T
M68AW512ML70ND1 STMicroelectronics Check for Price 512KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs M68AW512ML70ND1
Part Number Manufacturer Composite Price Description Compare
CY62157EV30LL-55ZSXE Cypress Semiconductor $19.7095 Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 M68AW512ML70ND6 vs CY62157EV30LL-55ZSXE
IS61LV51216-8TL Integrated Silicon Solution Inc Check for Price Standard SRAM, 512KX16, 8ns, CMOS, PDSO44, LEAD FREE, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs IS61LV51216-8TL
IS62WV51216BLL-70TI Integrated Silicon Solution Inc Check for Price Standard SRAM, 512KX16, 70ns, CMOS, PDSO44, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs IS62WV51216BLL-70TI
HM62V16514LTTI-5 Renesas Electronics Corporation Check for Price 512KX16 STANDARD SRAM, 55ns, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs HM62V16514LTTI-5
K6X8016C3B-UF550 Samsung Semiconductor Check for Price Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 M68AW512ML70ND6 vs K6X8016C3B-UF550
IS66WV51216DALL-70TLI Integrated Silicon Solution Inc Check for Price Pseudo Static RAM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 M68AW512ML70ND6 vs IS66WV51216DALL-70TLI
K6X8016T3B-UQ700 Samsung Semiconductor Check for Price Standard SRAM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 M68AW512ML70ND6 vs K6X8016T3B-UQ700
K6F8016U3M-RB70 Samsung Semiconductor Check for Price Standard SRAM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 M68AW512ML70ND6 vs K6F8016U3M-RB70
M68AW512ML55ND1T STMicroelectronics Check for Price 512KX16 STANDARD SRAM, 55ns, PDSO44, PLASTIC, TSOP2-44 M68AW512ML70ND6 vs M68AW512ML55ND1T
K6F8016U3M-RB550 Samsung Semiconductor Check for Price Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 M68AW512ML70ND6 vs K6F8016U3M-RB550

M68AW512ML70ND6 Related Parts

M68AW512ML70ND6 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for the M68AW512ML70ND6 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 150°C.

  • The M68AW512ML70ND6 has an internal POR and BOR circuitry. To handle these, ensure that the power supply ramps up slowly (typically <10 ms) to avoid false resets. Also, use an external capacitor (e.g., 10 nF) between the VDD and VSS pins to filter out noise and improve POR/BOR performance.

  • The M68AW512ML70ND6 can operate at a maximum clock frequency of 70 MHz, as specified in the datasheet. However, the actual clock frequency may be limited by the specific application, board design, and environmental conditions.

  • The M68AW512ML70ND6 has several low-power modes, including Sleep, Stop, and Standby. To configure these modes, use the Power Management Controller (PMC) registers to control the clock gating, voltage scaling, and power domains. Refer to the datasheet and application notes for specific guidance on configuring low-power modes.

  • When designing a PCB with the M68AW512ML70ND6, ensure that the layout follows good high-frequency design practices, such as using a solid ground plane, minimizing signal trace lengths, and avoiding signal crosstalk. Also, consider the thermal management of the device, as it can dissipate significant power during operation.

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