Part Details for M2S150-FCVG484I by Microsemi Corporation
Results Overview of M2S150-FCVG484I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S150-FCVG484I Information
M2S150-FCVG484I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2S150-FCVG484I
M2S150-FCVG484I CAD Models
M2S150-FCVG484I Part Data Attributes
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M2S150-FCVG484I
Microsemi Corporation
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Datasheet
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M2S150-FCVG484I
Microsemi Corporation
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA484, VFBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | VFBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Additional Feature | LG-MIN, WD-MIN | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Inputs | 273 | |
| Number of Logic Cells | 146124 | |
| Number of Outputs | 273 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.15 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm |
Alternate Parts for M2S150-FCVG484I
This table gives cross-reference parts and alternative options found for M2S150-FCVG484I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S150-FCVG484I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2S150-FCV484 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 146124-Cell, CMOS, PBGA484, VFBGA-484 | M2S150-FCVG484I vs M2S150-FCV484 |
M2S150-FCVG484I Frequently Asked Questions (FAQ)
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Microsemi provides a reference design guide for PCB layout and thermal management, which includes recommendations for heat sink attachment, thermal interface materials, and PCB stack-up. It's essential to follow these guidelines to ensure optimal performance and reliability.
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Microsemi provides a Clock Domain Crossing (CDC) User Guide that explains how to implement CDC in your design. It's crucial to follow the guidelines to ensure data integrity and prevent metastability issues.
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Microsemi provides a Radiation and High-Reliability User Guide that outlines the constraints and limitations for using the M2S150-FCVG484I in such applications. It's essential to follow the guidelines to ensure the device meets the required radiation and reliability standards.
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Microsemi provides a Power Management User Guide that explains how to optimize power consumption. Techniques include using power-saving modes, reducing clock frequencies, and optimizing voltage levels. Additionally, the device has built-in power-saving features, such as dynamic voltage and frequency scaling.
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Microsemi provides a High-Speed Digital Design Guide that outlines recommended design practices, including signal integrity considerations, PCB layout guidelines, and termination schemes. It's essential to follow these guidelines to ensure signal integrity and prevent errors.