Part Details for M2S090TS-1FGG676I by Microchip Technology Inc
Results Overview of M2S090TS-1FGG676I by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M2S090TS-1FGG676I Information
M2S090TS-1FGG676I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090TS-1FGG676I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8587
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FGG676I RoHS: Compliant Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$355.4700 / $381.5900 | Buy Now |
DISTI #
M2S090TS-1FGG676I-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 676FBGA Min Qty: 40 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$381.5922 | Buy Now |
DISTI #
M2S090TS-1FGG676I
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Avnet Americas | FPGA SmartFusion2 86184 Cells 65nm Technology 1.2V 676-Pin FPBGA - Trays (Alt: M2S090TS-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$303.6153 / $324.3750 | Buy Now |
DISTI #
494-M2S090TS1FGG676I
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant | 0 |
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$381.5900 | Order Now |
DISTI #
M2S090TS-1FGG676I
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, PBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 5A992.c RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
11 Alternates Available |
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$181.4600 / $381.5900 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$328.9100 / $965.3400 | Buy Now |
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NAC | M2S090TS-1FGG676I RoHS: Compliant Min Qty: 40 Package Multiple: 40 Container: Tray | 0 |
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$316.4600 / $370.7100 | Buy Now |
DISTI #
M2S090TS-1FGG676I
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Avnet Silica | FPGA SmartFusion2 86184 Cells 65nm Technology 12V 676Pin FPBGA (Alt: M2S090TS-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
M2S090TS-1FGG676I
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EBV Elektronik | FPGA SmartFusion2 86184 Cells 65nm Technology 12V 676Pin FPBGA (Alt: M2S090TS-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Master Electronics | RoHS: Compliant | 0 |
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$328.9100 / $965.3400 | Buy Now |
Part Details for M2S090TS-1FGG676I
M2S090TS-1FGG676I CAD Models
M2S090TS-1FGG676I Part Data Attributes
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M2S090TS-1FGG676I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2S090TS-1FGG676I
Microchip Technology Inc
Field Programmable Gate Array, PBGA676
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | FBGA-676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | Microchip | |
JESD-30 Code | S-PBGA-B676 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 425 | |
Number of Logic Cells | 86184 | |
Number of Outputs | 425 | |
Number of Terminals | 676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FPGA SOC | |
Seated Height-Max | 2.44 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 27 mm |
Alternate Parts for M2S090TS-1FGG676I
This table gives cross-reference parts and alternative options found for M2S090TS-1FGG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S090TS-1FGG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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M2S090TS-1FG676 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676, FBGA-676 | M2S090TS-1FGG676I vs M2S090TS-1FG676 |
M2S090TS-1FG484 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484 | M2S090TS-1FGG676I vs M2S090TS-1FG484 |
M2S090TS-1FG484M | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484 | M2S090TS-1FGG676I vs M2S090TS-1FG484M |
M2S090TS-1FGG484T2 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 86184-Cell, PBGA484 | M2S090TS-1FGG676I vs M2S090TS-1FGG484T2 |
M2S090TS-1FGG484T2 | Microsemi Corporation | Check for Price | IC FPGA SOC | M2S090TS-1FGG676I vs M2S090TS-1FGG484T2 |
M2S090TS-1FGG676T2 | Microsemi Corporation | Check for Price | IC FPGA SOC | M2S090TS-1FGG676I vs M2S090TS-1FGG676T2 |
M2S090TS-1FG484I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484 | M2S090TS-1FGG676I vs M2S090TS-1FG484I |
M2S090TS-1FGG676I Frequently Asked Questions (FAQ)
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Microchip provides a PCB design guide and layout recommendations in the M2S090TS-1FGG676I FPGA PCB Design and Layout Guidelines document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
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To minimize power consumption, use the Power Estimator tool provided by Microchip to estimate power consumption based on your design. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, ensure proper thermal management by using heat sinks, thermal interfaces, and airflow management.
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Implement security measures such as bitstream encryption, secure boot mechanisms, and access control to prevent unauthorized access. Use Microchip's Secure Boot and Anti-Tamper features to protect your IP. Additionally, follow secure coding practices, use secure communication protocols, and implement tamper-evident and tamper-resistant design techniques.
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Use Microchip's Libero SoC Design Suite, which provides a comprehensive development environment for designing, debugging, and testing your FPGA design. Utilize the built-in debugging tools, such as the Signal Tap Logic Analyzer and the ChipScope Pro tool, to identify and isolate issues. Additionally, implement debug-friendly design practices, such as adding debug ports and using assertions.
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The M2S090TS-1FGG676I FPGA is not specifically designed for high-reliability or safety-critical applications. However, Microchip provides guidance on using their FPGAs in such applications through their Functional Safety and Reliability documentation. It's essential to carefully evaluate the FPGA's capabilities, perform thorough testing and validation, and implement safety mechanisms, such as redundancy and error correction, to ensure the required level of reliability and safety.