Part Details for M2S090TS-1FG484M by Microchip Technology Inc
Results Overview of M2S090TS-1FG484M by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Smart Cities
Aerospace and Defense
Agriculture Technology
Robotics and Drones
M2S090TS-1FG484M Information
M2S090TS-1FG484M by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090TS-1FG484M
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
33AJ8590
|
Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FG484M RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$644.5600 / $681.9300 | Buy Now |
|
DISTI #
M2S090TS-1FG484M-ND
|
DigiKey | IC SOC CORTEX-M3 166MHZ 484FBGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$691.9715 | Buy Now |
|
DISTI #
M2S090TS-1FG484M
|
Avnet Americas | FPGA SmartFusion2 Family 86316 Cells 65nm Technology 1.2V 484-Pin FPBGA - Trays (Alt: M2S090TS-1FG484M) RoHS: Not Compliant Min Qty: 60 Package Multiple: 1 Lead time: 52 Weeks, 5 Days Container: Tray | 0 |
|
$550.5323 / $588.1750 | Buy Now |
|
DISTI #
494-M2S090TS-1FG484M
|
Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Not Compliant | 0 |
|
$691.9700 | Order Now |
|
DISTI #
M2S090TS-1FG484M
|
Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, PBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A001.a.2.c RoHS: Compliant Container: Tray |
0 Alternates Available |
|
$329.0500 / $691.9700 | Buy Now |
|
|
Onlinecomponents.com | RoHS: Compliant | 0 |
|
$596.3900 / $1,750.4100 | Buy Now |
|
|
NAC | M2S090TS-1FG484M RoHS: Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
|
$588.1700 / $627.3900 | Buy Now |
|
DISTI #
M2S090TS-1FG484M
|
Avnet Silica | FPGA SmartFusion2 Family 86316 Cells 65nm Technology 12V 484Pin FPBGA (Alt: M2S090TS-1FG484M) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
DISTI #
M2S090TS-1FG484M
|
EBV Elektronik | FPGA SmartFusion2 Family 86316 Cells 65nm Technology 12V 484Pin FPBGA (Alt: M2S090TS-1FG484M) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | EBV - 0 |
|
Buy Now | |
|
|
Master Electronics | RoHS: Compliant | 0 |
|
$596.3900 / $1,750.4100 | Buy Now |
Part Details for M2S090TS-1FG484M
M2S090TS-1FG484M CAD Models
M2S090TS-1FG484M Part Data Attributes
|
|
M2S090TS-1FG484M
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
M2S090TS-1FG484M
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 52 Weeks, 5 Days | |
| Samacsys Manufacturer | Microchip | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 267 | |
| Number of Logic Cells | 86184 | |
| Number of Outputs | 267 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
M2S090TS-1FG484M Frequently Asked Questions (FAQ)
-
Microchip provides a PCB design guide for the M2S090TS-1FG484M, which includes recommendations for PCB layout, routing, and signal integrity. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
-
A reliable POR circuit is crucial for the FPGA to function correctly. Microchip recommends using an external POR circuit with a voltage supervisor IC, such as the MIC5233, to ensure a clean power-on reset. The datasheet provides a reference design for a POR circuit.
-
The M2S090TS-1FG484M has a thermal design power (TDP) of 3.5W. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microchip provides thermal modeling and simulation tools to help with thermal design.
-
To optimize power consumption, it's essential to understand the power consumption of each component and optimize the design accordingly. Microchip provides power estimation tools and guidelines for power optimization, including clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
-
The M2S090TS-1FG484M has built-in security features, including a secure boot mechanism, encryption, and authentication. Microchip provides documentation and guidelines for implementing these security features, including the use of secure boot mechanisms and encryption algorithms.