Datasheets
M2S090TS-1FCSG325I by:

Field Programmable Gate Array, 86316-Cell, CMOS, PBGA325

Part Details for M2S090TS-1FCSG325I by Microchip Technology Inc

Results Overview of M2S090TS-1FCSG325I by Microchip Technology Inc

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M2S090TS-1FCSG325I Information

M2S090TS-1FCSG325I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for M2S090TS-1FCSG325I

Part # Distributor Description Stock Price Buy
DISTI # 33AJ8580
Newark Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 325 Tfbga 11X13.5X1.16Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 50 $238.7600
  • 250 $232.0300
  • 500 $225.6700
$225.6700 / $238.7600 Buy Now
DISTI # M2S090TS-1FCSG325I-ND
DigiKey IC SOC CORTEX-M3 166MHZ 325BGA Min Qty: 176 Lead time: 14 Weeks Container: Tray Temporarily Out of Stock
  • 176 $238.7613
$238.7613 Buy Now
DISTI # M2S090TS-1FCSG325I
Avnet Americas FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA - Trays (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray 0
  • 176 $224.8567
  • 352 $219.9156
  • 704 $214.9736
  • 1,056 $210.0317
  • 1,408 $205.0896
$205.0896 / $224.8567 Buy Now
DISTI # 494-S090TS1FCSG325I
Mouser Electronics SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant 0
  • 176 $238.7600
$238.7600 Order Now
DISTI # M2S090TS-1FCSG325I
Microchip Technology Inc SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, TFBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 5A992.c RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray 0

Alternates Available
  • 1 $242.2800
  • 50 $238.7600
  • 250 $232.0300
  • 500 $225.6700
  • 1,000 $126.7200
  • 5,000 $115.2000
$115.2000 / $242.2800 Buy Now
Onlinecomponents.com   RoHS: Compliant 108 Factory Stock
  • 44 $612.8000
  • 88 $312.9900
  • 132 $213.0500
  • 176 $208.7900
$208.7900 / $612.8000 Buy Now
DISTI # M2S090TS-1FCSG325I
IBS Electronics M2S090TS-1FCSG325I by Microchip is a SmartFusion2 SoC FPGA with 90K logic elements, 325-ball FBGA, integrated ARM Cortex-M3, and advanced security features, ideal for low-power applications. Min Qty: 1 Package Multiple: 1 0
  • 1 $249.8470
  • 3 $245.9340
  • 5 $244.1400
  • 10 $241.7350
  • 20 $237.9520
$237.9520 / $249.8470 Buy Now
NAC M2S090TS-1FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray 0
  • 1 $235.3300
  • 100 $216.7500
  • 500 $205.9100
  • 800 $200.8900
$200.8900 / $235.3300 Buy Now
DISTI # M2S090TS-1FCSG325I
Avnet Silica FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 12V 325Pin FBGA (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 16 Weeks, 0 Days Silica - 0
Buy Now
DISTI # M2S090TS-1FCSG325I
EBV Elektronik FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 12V 325Pin FBGA (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 15 Weeks, 0 Days EBV - 0
Buy Now
Master Electronics   RoHS: Compliant 108 Factory Stock
  • 44 $612.8000
  • 88 $312.9900
  • 132 $213.0500
  • 176 $208.7900
$208.7900 / $612.8000 Buy Now
Vyrian Programmable ICs 288
RFQ

Part Details for M2S090TS-1FCSG325I

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M2S090TS-1FCSG325I Part Data Attributes

M2S090TS-1FCSG325I Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
M2S090TS-1FCSG325I Microchip Technology Inc Field Programmable Gate Array, 86316-Cell, CMOS, PBGA325
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description FCBGA-325
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Factory Lead Time 14 Weeks
JESD-30 Code R-PBGA-B325
Length 13.5 mm
Moisture Sensitivity Level 3
Number of Inputs 180
Number of Logic Cells 86184
Number of Outputs 180
Number of Terminals 325
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA325,21X21,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FPGA SOC
Seated Height-Max 1.16 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 11 mm

M2S090TS-1FCSG325I Related Parts

M2S090TS-1FCSG325I Frequently Asked Questions (FAQ)

  • Microchip provides a PCB design guide and layout recommendations in the M2S090TS-1FCSG325I FPGA PCB Design Considerations document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.

  • To minimize power consumption, use the Power Estimator tool provided by Microchip to estimate power consumption based on your design. Implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, ensure proper thermal management by using heat sinks, thermal interfaces, and airflow management.

  • Implement security measures like bitstream encryption, secure boot mechanisms, and access controls to prevent unauthorized access. Use Microchip's Secure Boot and Anti-Tamper features, and consider using a secure programming interface like the Microchip CryptoAuthentication device.

  • Implement error correction mechanisms like ECC, CRC, and checksums to detect and correct errors. Use redundant logic and voting mechanisms to ensure fault tolerance. Additionally, follow Microchip's guidelines for operating the FPGA in harsh environments, such as extreme temperatures, radiation, and vibration.

  • The M2S090TS-1FCSG325I has a maximum clock frequency of 500 MHz. To achieve high-speed operation, ensure proper signal integrity, use differential signaling, and implement clock domain crossing techniques. Additionally, consider using the FPGA's built-in high-speed interfaces like PCIe, SATA, and Gigabit Ethernet.

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