Part Details for M2S090TS-1FCSG325I by Microchip Technology Inc
Results Overview of M2S090TS-1FCSG325I by Microchip Technology Inc
- Distributor Offerings: (12 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M2S090TS-1FCSG325I Information
M2S090TS-1FCSG325I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090TS-1FCSG325I
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
33AJ8580
|
Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 325 Tfbga 11X13.5X1.16Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$225.6700 / $238.7600 | Buy Now |
DISTI #
M2S090TS-1FCSG325I-ND
|
DigiKey | IC SOC CORTEX-M3 166MHZ 325BGA Min Qty: 176 Lead time: 14 Weeks Container: Tray | Temporarily Out of Stock |
|
$238.7613 | Buy Now |
DISTI #
M2S090TS-1FCSG325I
|
Avnet Americas | FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA - Trays (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
|
$205.0896 / $224.8567 | Buy Now |
DISTI #
494-S090TS1FCSG325I
|
Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant | 0 |
|
$238.7600 | Order Now |
DISTI #
M2S090TS-1FCSG325I
|
Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, TFBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 5A992.c RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray |
0 Alternates Available |
|
$115.2000 / $242.2800 | Buy Now |
|
Onlinecomponents.com | RoHS: Compliant | 108 Factory Stock |
|
$208.7900 / $612.8000 | Buy Now |
DISTI #
M2S090TS-1FCSG325I
|
IBS Electronics | M2S090TS-1FCSG325I by Microchip is a SmartFusion2 SoC FPGA with 90K logic elements, 325-ball FBGA, integrated ARM Cortex-M3, and advanced security features, ideal for low-power applications. Min Qty: 1 Package Multiple: 1 | 0 |
|
$237.9520 / $249.8470 | Buy Now |
|
NAC | M2S090TS-1FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray | 0 |
|
$200.8900 / $235.3300 | Buy Now |
DISTI #
M2S090TS-1FCSG325I
|
Avnet Silica | FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 12V 325Pin FBGA (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 16 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
M2S090TS-1FCSG325I
|
EBV Elektronik | FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 12V 325Pin FBGA (Alt: M2S090TS-1FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for M2S090TS-1FCSG325I
M2S090TS-1FCSG325I CAD Models
M2S090TS-1FCSG325I Part Data Attributes
|
M2S090TS-1FCSG325I
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
M2S090TS-1FCSG325I
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA325
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | FCBGA-325 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 14 Weeks | |
JESD-30 Code | R-PBGA-B325 | |
Length | 13.5 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 180 | |
Number of Logic Cells | 86184 | |
Number of Outputs | 180 | |
Number of Terminals | 325 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA325,21X21,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FPGA SOC | |
Seated Height-Max | 1.16 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 11 mm |
M2S090TS-1FCSG325I Frequently Asked Questions (FAQ)
-
Microchip provides a PCB design guide and layout recommendations in the M2S090TS-1FCSG325I FPGA PCB Design Considerations document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
-
To minimize power consumption, use the Power Estimator tool provided by Microchip to estimate power consumption based on your design. Implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, ensure proper thermal management by using heat sinks, thermal interfaces, and airflow management.
-
Implement security measures like bitstream encryption, secure boot mechanisms, and access controls to prevent unauthorized access. Use Microchip's Secure Boot and Anti-Tamper features, and consider using a secure programming interface like the Microchip CryptoAuthentication device.
-
Implement error correction mechanisms like ECC, CRC, and checksums to detect and correct errors. Use redundant logic and voting mechanisms to ensure fault tolerance. Additionally, follow Microchip's guidelines for operating the FPGA in harsh environments, such as extreme temperatures, radiation, and vibration.
-
The M2S090TS-1FCSG325I has a maximum clock frequency of 500 MHz. To achieve high-speed operation, ensure proper signal integrity, use differential signaling, and implement clock domain crossing techniques. Additionally, consider using the FPGA's built-in high-speed interfaces like PCIe, SATA, and Gigabit Ethernet.