Part Details for M2S090T-FGG676 by Microchip Technology Inc
Results Overview of M2S090T-FGG676 by Microchip Technology Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S090T-FGG676 Information
M2S090T-FGG676 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090T-FGG676
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8546
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-FGG676 RoHS: Compliant Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$258.5100 / $277.5200 | Buy Now |
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DISTI #
M2S090T-FGG676-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 676FBGA Min Qty: 40 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$277.5202 | Buy Now |
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DISTI #
M2S090T-FGG676
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Avnet Americas | FPGA SmartFusion2 Family 86184 Cells 166MHz 65nm Technology1.2V 676-Pin FBGA - Trays (Alt: M2S090T-FGG676) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$220.8026 / $236.8268 | Buy Now |
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DISTI #
494-M2S090T-FGG676
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant | 0 |
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$277.5200 | Order Now |
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DISTI #
M2S090T-FGG676
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, PBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A991.d RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
3980 Alternates Available |
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$131.9900 / $277.5200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 3980 Factory Stock |
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$241.6600 / $679.3900 | Buy Now |
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NAC | M2S090T-FGG676 RoHS: Compliant Min Qty: 40 Package Multiple: 40 Container: Tray | 0 |
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$230.1500 / $269.6000 | Buy Now |
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Master Electronics | RoHS: Compliant | 3980 Factory Stock |
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$241.6600 / $679.3900 | Buy Now |
Part Details for M2S090T-FGG676
M2S090T-FGG676 CAD Models
M2S090T-FGG676 Part Data Attributes
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M2S090T-FGG676
Microchip Technology Inc
Buy Now
Datasheet
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M2S090T-FGG676
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PBGA-B676 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 425 | |
| Number of Logic Cells | 86184 | |
| Number of Outputs | 425 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm |
M2S090T-FGG676 Frequently Asked Questions (FAQ)
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Microchip provides a PCB design guide and layout recommendations in their documentation, but it's also recommended to follow general high-speed PCB design principles, such as using differential pairs, minimizing trace lengths, and using ground planes to reduce noise and crosstalk.
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To optimize power consumption, engineers can use Microchip's PowerExplorer tool to estimate power consumption based on their design. They can also implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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To secure the FPGA's configuration, engineers can use Microchip's security features such as bitstream encryption, authentication, and secure boot mechanisms. They should also follow best practices for secure design, such as using secure protocols for configuration and data transfer, and implementing access controls and encryption for sensitive data.
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Microchip provides a range of debugging tools, including the ISE Design Suite and the Microchip Libero SoC Design Suite. Engineers can use these tools to simulate and verify their design, as well as to debug and troubleshoot issues using features such as signal tapping and logic analysis.
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The M2S090T-FGG676 FPGA has a maximum junction temperature of 100°C. Engineers should ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following Microchip's thermal design guidelines to prevent overheating and ensure reliable operation.