Part Details for M2S090T-1FGG676I by Microchip Technology Inc
Results Overview of M2S090T-1FGG676I by Microchip Technology Inc
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S090T-1FGG676I Information
M2S090T-1FGG676I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090T-1FGG676I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8560
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FGG676I RoHS: Compliant Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$323.1500 / $346.9200 | Buy Now |
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DISTI #
M2S090T-1FGG676I-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 676FBGA Min Qty: 40 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$346.9210 | Buy Now |
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DISTI #
M2S090T-1FGG676I
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Avnet Americas | ACLM2S090T-1FGG676I - Trays (Alt: M2S090T-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$275.9916 / $296.0286 | Buy Now |
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DISTI #
494-M2S090T-1FGG676I
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant | 0 |
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$346.9200 | Order Now |
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DISTI #
M2S090T-1FGG676I
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, PBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A991.d RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
105 Alternates Available |
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$164.9700 / $346.9200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 105 Factory Stock |
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$302.0700 / $849.2000 | Buy Now |
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NAC | M2S090T-1FGG676I RoHS: Compliant Min Qty: 40 Package Multiple: 40 Container: Tray | 0 |
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$287.6700 / $336.9900 | Buy Now |
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DISTI #
M2S090T-1FGG676I
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Avnet Silica | ACLM2S090T1FGG676I (Alt: M2S090T-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
M2S090T-1FGG676I
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EBV Elektronik | ACLM2S090T1FGG676I (Alt: M2S090T-1FGG676I) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Master Electronics | RoHS: Compliant | 105 Factory Stock |
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$302.0700 / $849.2000 | Buy Now |
Part Details for M2S090T-1FGG676I
M2S090T-1FGG676I CAD Models
M2S090T-1FGG676I Part Data Attributes
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M2S090T-1FGG676I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2S090T-1FGG676I
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Microchip | |
| JESD-30 Code | S-PBGA-B676 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 425 | |
| Number of Logic Cells | 86184 | |
| Number of Outputs | 425 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm |
M2S090T-1FGG676I Frequently Asked Questions (FAQ)
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Microchip provides a PCB design guide for the M2S090T-1FGG676I, which includes recommendations for PCB layout, routing, and thermal management. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and prevent thermal issues.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP1316, which provides a reset signal to the FPGA during power-up. The FPGA's internal POR circuit can also be used, but it's recommended to use an external voltage supervisor for added reliability.
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Use the Microchip Libero SoC design suite to configure and program the FPGA. Follow the design flow guidelines, and use the built-in tools for synthesis, placement, and routing. It's also essential to follow the recommended programming and configuration guidelines to ensure successful device operation.
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Follow the PCB design guidelines, use differential signaling where possible, and implement proper termination and filtering techniques. Additionally, use EMI-reducing techniques such as shielding, grounding, and decoupling to minimize electromagnetic radiation.
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The M2S090T-1FGG676I has a maximum junction temperature of 100°C. Ensure good airflow, use a heat sink if necessary, and follow the thermal management guidelines in the datasheet to prevent overheating. Monitor the device temperature using the built-in thermal sensor and take corrective action if necessary.