Part Details for M2S090T-1FG676I by Microchip Technology Inc
Results Overview of M2S090T-1FG676I by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S090T-1FG676I Information
M2S090T-1FG676I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090T-1FG676I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8565
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FG676I RoHS: Compliant Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$323.1500 / $346.9200 | Buy Now |
DISTI #
M2S090T-1FG676I-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 676FBGA Min Qty: 40 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$346.9210 | Buy Now |
DISTI #
M2S090T-1FG676I
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Avnet Americas | ACLM2S090T-1FG676I - Trays (Alt: M2S090T-1FG676I) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$323.1500 / $346.9200 | Buy Now |
DISTI #
494-M2S090T-1FG676I
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Not Compliant | 33 |
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$335.8500 / $339.0300 | Buy Now |
DISTI #
M2S090T-1FG676I
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, PBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A991.d RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$164.9700 / $346.9200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant |
14 In Stock 6 Factory Stock |
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$302.0700 / $875.2700 | Buy Now |
DISTI #
87723051
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Verical | FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2328 | Americas - 14 |
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$400.6990 / $1,137.8510 | Buy Now |
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NAC | M2S090T-1FG676I RoHS: Compliant Min Qty: 40 Package Multiple: 40 Container: Tray | 0 |
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$287.6700 / $336.9900 | Buy Now |
DISTI #
M2S090T-1FG676I
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Avnet Silica | ACLM2S090T1FG676I (Alt: M2S090T-1FG676I) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
M2S090T-1FG676I
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EBV Elektronik | ACLM2S090T1FG676I (Alt: M2S090T-1FG676I) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for M2S090T-1FG676I
M2S090T-1FG676I CAD Models
M2S090T-1FG676I Part Data Attributes
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M2S090T-1FG676I
Microchip Technology Inc
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Datasheet
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M2S090T-1FG676I
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | FBGA-676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | Microchip | |
JESD-30 Code | S-PBGA-B676 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 425 | |
Number of Logic Cells | 86184 | |
Number of Outputs | 425 | |
Number of Terminals | 676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 240 | |
Programmable Logic Type | FPGA SOC | |
Seated Height-Max | 2.44 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm |
M2S090T-1FG676I Frequently Asked Questions (FAQ)
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Microchip provides a PCB design guide for the M2S090T-1FG676I, which includes recommendations for PCB layout, routing, and signal integrity. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112-315JE/MS, which can detect the power supply voltage and generate a reset signal to the FPGA. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
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The M2S090T-1FG676I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microchip provides thermal modeling and simulation tools to help designers estimate the FPGA's thermal performance.
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To optimize power consumption, designers should consider using the FPGA's power-saving features, such as clock gating, dynamic voltage and frequency scaling, and power gating. Additionally, optimizing the design's clock frequency, using low-power modes, and minimizing unnecessary logic can help reduce power consumption.
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The M2S090T-1FG676I has built-in security features, such as secure boot, encryption, and authentication. Designers should consider implementing additional security measures, such as secure key storage, secure communication protocols, and access control mechanisms to protect the FPGA's configuration and data.